Chiplets with Connection Posts for Substrate Interconnection
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Solution Overview
Problem
Current methods for distributing electronically active components over substrates are limited by material waste, high processing costs, and difficulties in electrical interconnection of small integrated circuits like chiplets to destination substrates, particularly due to topographical differences and the need for expensive equipment and complex adhesive curing processes.
Innovation Solution
The use of micro transfer printing with electrically conducting connection posts that protrude from chiplets, allowing for mechanical pressure to form electrical connections with backplane contact pads, and optional heat treatment or solder reflow for enhanced adhesion, along with redundant connection posts to reduce faults.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional substrate processing methods are used to form thin-film transistors, then substrate compatibility is improved, but manufacturing cost increases and material waste occurs
Solution Approach 1:
The invention divides the substrate processing into separate stages: first forming TFTs on a source substrate using conventional methods, then transferring only the finished chiplets to the destination substrate. This segmentation allows optimization of each stage independently, reducing overall manufacturing cost and material waste while maintaining substrate compatibility.
Solution Approach 2:
The invention extracts the finished chiplets from the source substrate after TFT formation and transfers them to the destination substrate. This extraction approach eliminates the need to process entire large substrates, reducing material waste and processing costs while maintaining compatibility with conventional TFT fabrication methods.
2Productivity
If pick-and-place technologies are used for integrated circuits, then component distribution is improved, but device size limitation occurs
Solution Approach 1:
The invention introduces a transfer substrate as an intermediary between the source substrate and destination substrate. Chiplets are first formed on the source substrate, then transferred to the transfer substrate where they can be positioned and distributed before final placement on the destination substrate. This intermediary approach enables efficient component distribution while accommodating various device sizes.
3Reliability
If mono-crystalline semiconductor wafers are used, then circuit performance is improved, but substrate size and cost are limited
Solution Approach 1:
The invention segments the mono-crystalline wafer into individual chiplets that can be transferred and distributed across a larger destination substrate. This allows the benefits of high-performance mono-crystalline material to be utilized while overcoming the size limitations of individual wafers, enabling large-area applications with high circuit performance.
4Reliability
If connection posts are used for electrical interconnection, then electrical connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The connection posts are integrated into the chiplet structure itself, forming as part of the TFT fabrication process. The chiplets self-align with the destination substrate through the connection posts, eliminating the need for separate alignment and bonding equipment. This self-service approach improves electrical connection reliability while reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient, cost-effective electrical interconnection of small integrated circuits to destination substrates with improved reliability and reduced manufacturing steps, minimizing material waste and processing costs while accommodating topographical differences.
Implementation Method 1
mechanical pressure to form electrical connections with backplane contact pads
Implementation Method 2
optional heat treatment or solder reflow for enhanced adhesion
Implementation Method 3
optional heat treatment or solder reflow for enhanced adhesion
Data Source
AI summary
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.