Semiconductor Light Emitting Device Display with Conductive Adhesive
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Solution Overview
Problem
Current display technologies, such as LCDs and AMOLEDs, face challenges including mediocre response time, difficulty in implementing flexibility, short lifespan, and low yield, while existing LED devices require complex fabrication processes.
Innovation Solution
A display device utilizing flip chip type semiconductor light emitting devices with a new structure, featuring a phosphor layer for color conversion and a conductive adhesive layer for electrical connection, allowing for fine pitch arrangement and simplifying the fabrication process by omitting etching or vacuum processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If LCDs are used for display, then flexibility can be implemented, but response time becomes mediocre
Solution Approach 1:
The patent replaces the liquid crystal mechanical system with a semiconductor light emitting device system. The semiconductor devices convert electrical current directly to light without requiring liquid crystal molecule reorientation, thereby eliminating the slow response time characteristic of LCDs while maintaining flexibility through the use of flexible substrates and conductive adhesive layers.
2Speed
If AMOLEDs are used for display, then response time is improved, but lifespan becomes short and yield is low
Solution Approach 1:
The patent changes the material parameters from organic compounds in AMOLEDs to inorganic semiconductor materials. This parameter change fundamentally improves device lifespan and manufacturing yield while maintaining the fast response time characteristic, as semiconductor materials are more stable and less prone to degradation than organic materials.
3Reliability
If conventional LED devices are used, then lifespan is improved, but fabrication process becomes complex
Solution Approach 1:
The patent merges multiple fabrication steps into a single simplified process. By forming conductive electrodes and conductive adhesive layers in the same process step, and by using a unified semiconductor light emitting device structure that integrates both light emission and electrical connection functions, the complex multi-step fabrication process is reduced to a more streamlined process while maintaining the long lifespan advantage of LED technology.
4Manufacturing precision
If fine pitch arrangement is implemented, then display resolution is improved, but fabrication complexity increases
Solution Approach 1:
The patent segments the display into discrete semiconductor light emitting devices arranged in a fine pitch pattern. Each semiconductor device acts as an independent pixel element with integrated electrodes, allowing precise positioning and fine pitch arrangement without requiring complex inter-electrode routing. The segmentation into modular semiconductor devices simplifies the fabrication of high-resolution displays compared to continuous electrode patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of flexible, rollable displays with high luminance and fine pitch capabilities, simplifying the fabrication process and reducing the complexity of electrode formation.
Implementation Method 1
a phosphor layer which is formed to convert a predetermined light into at least one of red light, green light and blue light
Data Source
Figure 1~2
Figure 3a~5a
Figure 5b~5c
AI summary
Discussed is a display device including a wiring substrate disposed with a first electrode; a conductive adhesive layer disposed between the wiring substrate and a second electrode; and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first electrode and the second electrode, wherein at least one of the plurality of semiconductor light emitting devices comprises a first conductive electrode and a second conductive electrode disposed to be separated from each other, the at least one of the semiconductor light emitting devices having a lateral surface, and wherein the second conductive electrode extends beyond the lateral surface of the at least one of semiconductor light emitting devices.