Wiring Board Segmented Substrate for Device Integration

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Solution Overview

Problem

Existing wiring board manufacturing methods face challenges in effectively integrating multiple electronic devices with robust electrical connections and reliable insulation, leading to issues with device positioning, electrical connectivity, and structural integrity.

Innovation Solution

A wiring board design featuring a substrate with multiple opening portions separated by boundary portions, where a conductive pattern and insulation layer are formed to cover electronic devices, enhancing structural strength and electrical connectivity through integrated conductive patterns and insulation layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple electronic devices are integrated in opening portions of the substrate, then the functionality and connectivity of the wiring board are improved, but the positioning precision and structural stability may deteriorate

Engineering Contradiction:

Improvefunctionality and connectivityVSAvoidpositioning precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The substrate is divided into multiple opening portions separated by boundary portions, creating distinct regions for housing different electronic devices. This segmentation allows each device to be precisely positioned within its own defined space while maintaining overall board functionality and connectivity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Boundary portions are formed in the substrate before electronic devices are positioned in the opening portions. This preliminary action establishes precise positioning structures in advance, ensuring accurate device placement and structural stability during subsequent manufacturing steps.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If conductive patterns and insulation layers are formed to cover electronic devices, then electrical connectivity and insulation are improved, but the manufacturing complexity increases

Engineering Contradiction:

Improveelectrical connectivity and insulationVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The conductive pattern formation and insulation layer deposition are integrated into a unified manufacturing process sequence. By combining these operations and forming them on the same boundary portions, the process achieves reliable electrical connectivity and insulation while reducing overall manufacturing complexity compared to separate, multi-step approaches.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The boundary portions serve multiple functions: they separate opening portions for device positioning, provide substrates for conductive pattern formation, and support insulation layer deposition. This multi-functionality reduces the number of separate manufacturing steps needed, simplifying the overall process while ensuring reliable electrical connectivity and insulation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Strength

If boundary portions are formed to separate opening portions, then the structural strength is improved, but the manufacturing steps increase

Engineering Contradiction:

Improvestructural strengthVSAvoidmanufacturing steps

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The substrate is segmented into distinct opening portions by forming boundary portions between them. This segmentation inherently provides structural strength by creating defined regions, and the same segmented structures are subsequently used for conductive pattern formation, eliminating the need for separate reinforcing elements and reducing overall manufacturing steps.

Inventive Principle:

Principle #1Segmentation

4Adaptability or versatility

If electronic devices are positioned in opening portions, then the device integration is improved, but the positioning accuracy may deteriorate

Engineering Contradiction:

Improvedevice integrationVSAvoidpositioning accuracy

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

Boundary portions are formed in the substrate before electronic devices are positioned in the opening portions. This preliminary action creates precise positioning structures and defined boundaries in advance, ensuring accurate device placement within each opening portion while maintaining flexibility for different device configurations.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9883592B2Wiring board and method for manufacturing the same

Publication Date: 2018.01.30 IBIDEN CO LTD

AI summary

A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. The boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm.