Resiliently Flexible Leads for Thermal Surface Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing surface mount technology (SMT) assembly processes are inefficient and costly due to the time-consuming and expensive process of aligning heat transfer surfaces in a common plane for interfacing with a heat sink, which often results in entire circuit boards being scrapped if a single package is faulty, limiting the size of package arrays designed and manufactured.
Innovation Solution
A surface mount system with resiliently flexible leads that can deflect to align heat transfer surfaces in a common plane, facilitated by a planarization tool with a movable alignment member and backing member, allowing for easy alignment and replacement of faulty devices without the need for re-lapping sacrificial material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If gap filler material is applied and ground/lapped to align heat transfer surfaces, then heat transfer surface alignment is improved, but manufacturing time and cost increase
Solution Approach 1:
The patent applies gap filler material before the packages are permanently fixed to the circuit board, allowing alignment adjustments to be made while the packages are still movable. This preliminary alignment action eliminates the need for time-consuming grinding and lapping operations that would require permanent fixation first.
Solution Approach 2:
The patent uses a removable gap filler material that can be easily applied and removed without damaging the packages or circuit board. This disposable-like approach to alignment material eliminates the need for expensive and time-consuming precision machining operations.
2Manufacturing precision
If gap filler material is applied and ground/lapped to align heat transfer surfaces, then heat transfer surface alignment is improved, but manufacturing cost increases
Solution Approach 1:
The patent performs alignment using gap filler material before permanent fixation, eliminating the need for expensive precision grinding and lapping equipment and operations. This preliminary alignment approach uses simple, low-cost materials and methods.
Solution Approach 2:
The patent employs inexpensive gap filler material that can be easily applied and removed, replacing the need for costly precision machining operations. The gap filler serves as a temporary, low-cost alignment aid that eliminates expensive manufacturing steps.
3Productivity
If traditional SMT assembly is used with multiple packages, then production capacity is increased, but risk of total board scrapping due to single package failure increases
Solution Approach 1:
The patent enables individual packages to be independently replaced on the circuit board without affecting other packages. The gap filler alignment method allows for selective rework of individual packages, segmenting the replacement process so that only faulty packages need to be removed and replaced, rather than scrapping the entire board.
Solution Approach 2:
The patent allows for the recovery and reuse of the circuit board after replacing only the faulty package. The gap filler material enables easy removal and replacement of individual packages, allowing the board to be recovered and reused rather than discarded entirely when a single package fails.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables fast, inexpensive assembly and alignment of heat transfer surfaces across multiple devices, allowing for easy replacement of faulty components, reducing assembly costs and minimizing scrap, and enabling the design of larger arrays without the risk of costly rework.
Implementation Method 1
resiliently flexible lead electrically coupled to the electronic component and to the circuit board, wherein the resiliently flexible leads are individually deflected a distance sufficient to cause the heat transfer surfaces
Data Source
Figure 1~2C
Figure 3A~3D
Figure 4A
AI summary
A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.