Probe Card Solder Fillet Formation for High Density Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization and high density of semiconductor integrated circuits make it difficult to apply sufficient solder cream to connection pads for reliable coupling between probes and a connection base plate in probe cards, especially when using thin metal wires.
Innovation Solution
A method involving a holding plate with through holes or enlarged openings to hold probes, where solder cream is applied and then heated to form a fillet between the probes and connection pads, ensuring strong coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If connection pads are miniaturized to achieve high density integration, then the density and integration of semiconductor circuits are improved, but the ability to apply sufficient solder cream to each connection pad deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the connection base plate at positions corresponding to connection pads before the soldering process. These recesses are prepared in advance to receive and hold sufficient solder cream, ensuring that even with miniaturized connection pads, there is adequate space to apply the required amount of solder cream for reliable probe coupling.
2Productivity
If connection pads are miniaturized to achieve high density integration, then the density and integration of semiconductor circuits are improved, but the reliability of probe coupling deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the connection base plate at positions corresponding to connection pads before the soldering process. These recesses are prepared in advance to receive and hold sufficient solder cream, ensuring that even with miniaturized connection pads, there is adequate space to apply the required amount of solder cream for reliable probe coupling.
3Manufacturing precision
If solder cream is applied by printing technique to miniaturized connection pads, then the precision of solder application is improved, but the sufficiency of solder quantity deteriorates
Solution Approach 1:
The patent applies segmentation by dividing the connection base plate into multiple regions, each containing a recess corresponding to a connection pad. This segmentation allows each recess to be independently filled with solder cream, ensuring both precise positioning and sufficient quantity. The recesses are formed as discrete cavities that can be individually filled, overcoming the limitation of printing techniques that struggle to deposit adequate amounts of solder on miniaturized pads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the formation of an appropriate fillet between the probes and connection pads, enhancing coupling strength and reliability, even with miniaturized components.
Implementation Method 1
a coupling portion is heated to electrically and mechanically couple each probe with the connection base plate
Implementation Method 2
heating the solder cream for melting of the solder cream for the purpose of coupling the connecting end portions of the respective probes with the respective connection pads
Implementation Method 3
by forming an appropriate fillet by the solder between the base end of the probe and the corresponding connection pad, reliability of coupling of each probe with the connection base plate can be enhanced
Data Source
AI summary
A method for manufacturing a probe card is provided wherein probes are held in a holding plate such that the respective probes correspond to through holes with their connecting end portions projected from one surface of the holding plate. A plate-like member including openings having larger diameters than diameters of the through holes and housing the connecting end portions in the openings is arranged by making one surface of the plate-like member abut the one surface of the holding plate. After supplying solder cream in the respective openings from the other surface of the plate-like member, a connection base plate and the holding plate are relatively fixed so that the solder cream, burying the connecting end portions of the respective probes held in the holding plate with the plate-like member removed, may abut the respective corresponding connection pads, and the solder cream is heated to melt the solder cream.