Component Placement Accuracy via Local Measuring System
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Solution Overview
Problem
Existing component placement devices on substrates suffer from low accuracy due to low rigidity and sensitivity to thermal effects, with geometrical deviations amplified by the distance between the global measuring system and the nozzle, leading to inaccurate positioning of components.
Innovation Solution
A local measuring system is introduced closer to the substrate carrier, comprising a grid and sensors to determine the position of the component pick-and-place device with high precision, reducing the number of parts between the measuring system and the nozzle, thereby enhancing rigidity and stability, and using imaging devices to calculate the component's position relative to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a global measuring system is used to determine the position of the component pick-and-place device, then the measurement range is sufficient, but the measurement precision deteriorates due to the large distance between the measuring system and the nozzle
Solution Approach 1:
The patent divides the measuring system into two segments: a global measuring system for determining the overall position of the component pick-and-place device, and a local measuring system for precisely determining the position of the nozzle. This segmentation allows each subsystem to optimize for its specific function, resolving the contradiction between measurement range and precision.
2Adaptability or versatility
If the number of parts between the Y-slides and the nozzle is kept large to accommodate all necessary components, then the device functionality is complete, but the rigidity deteriorates leading to lower positioning accuracy
Solution Approach 1:
The patent segments the device structure into distinct functional modules: the component pick-and-place device with its necessary components, and the measuring systems positioned at optimal locations. This allows the main structure to maintain necessary functionality while the measuring systems are positioned to maximize rigidity and minimize the number of parts between the measurement point and the nozzle.
3Area of stationary object
If the distance between the measuring system and the substrate carrier is increased to improve the measurement range, then the global coverage is better, but the geometrical deviations are amplified
Solution Approach 1:
The patent implements a hierarchical measurement architecture with a global measuring system positioned at a distance for comprehensive coverage, and a local measuring system positioned close to the substrate carrier for high-precision measurements. This segmentation allows the system to simultaneously achieve both wide measurement coverage and high precision by using the appropriate subsystem for each measurement task.
Solution Approach 2:
The local measuring system acts as an intermediary between the global measuring system and the nozzle, compensating for geometrical deviations that are amplified by distance. The local system provides real-time position feedback that corrects for errors introduced by the global system's distance from the substrate carrier.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the accuracy of component placement by reducing the impact of geometrical deviations and thermal effects, allowing for precise movement and placement of components with a high degree of accuracy, from 10 microns to 0.1 microns, by utilizing a local measuring system and grid-based positioning.
Implementation Method 1
a sensor that is connected to the component pick-and-place device, by means of which sensor the position of the component pick-and-place device can be determined with respect to the grid
Data Source
AI summary
A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.