Inductor with Magnetic Element and Insulating Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inductors face challenges in achieving sufficient inductance for high-frequency applications due to power loss and low Q-factor, and their manufacturing process is complex, leading to production issues and high costs, especially with 2.5D and 3D stacking technologies.
Innovation Solution
The design incorporates a conductive structure with a magnetic element and an insulating layer, which enhances magnetic flux and simplifies the manufacturing process by integrating a pre-formed inductor unit with a capacitor structure and redistribution layers, reducing the need for complex conductive pillar formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If magnetic materials are embedded in the conductive coil to enhance inductance, then the inductance value increases, but the power loss increases and Q-factor decreases
Solution Approach 1:
The patent divides the inductor structure into separate functional components: a conductive coil structure for generating magnetic flux and a magnetic element positioned adjacent to it for enhancing inductance. This segmentation allows the conductive coil to maintain low loss characteristics while the magnetic element provides inductance enhancement, resolving the contradiction between achieving high inductance and minimizing power loss.
2Reliability
If conventional conductive pillar formation process is used to connect RDLs, then electrical connection is achieved, but the process becomes complicated and production yield decreases
Solution Approach 1:
The patent merges the inductor structure with the substrate or packaging structure, integrating multiple functions into a unified design. The conductive coil is formed using standard semiconductor fabrication processes on the substrate, and the magnetic element is positioned adjacent to it, eliminating the need for separate complex conductive pillar formation processes while maintaining reliable electrical connections.
3Volume of moving object
If 2.5D and 3D stacking technology is applied to achieve compact inductor design, then space utilization improves, but production cost increases significantly
Solution Approach 1:
The patent positions the magnetic element adjacent to the conductive coil in the same plane or nearby layer, utilizing spatial arrangement in two or three dimensions to achieve compact design. This approach provides space efficiency comparable to 2.5D/3D stacking but uses standard fabrication processes, avoiding the high production costs associated with advanced stacking technologies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a circuit structure with greater inductance and higher production yield, while minimizing power loss and improving the Q-factor, thus addressing the limitations of conventional inductors.
Implementation Method 1
The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure.
Data Source
AI summary
An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.