Solid Electrolytic Capacitor Nanofilm Sealing
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Solution Overview
Problem
Existing solid electrolytic capacitor package structures face issues with achieving air-tight and water-tight properties due to differences in heat expansion coefficients between synthetic resin and capacitor materials, leading to potential short circuits and current leakage.
Innovation Solution
A method involving a pre-treatment step to form an electrode pin protective film, followed by a coating step using a nanomaterial to seal microstructures within the package structure, and a post-treatment step to remove the protective film, where the nanomaterial forms a nanofilm that penetrates and seals microvoids and microgaps, enhancing the package's air-tight and water-tight properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If synthetic resin is used for enclosing the capacitor assembly and electrode pins to form a package body, then the package structure is formed, but air-tight and water-tight properties cannot be achieved due to different heat expansion coefficients between the synthetic resin and capacitor materials
Solution Approach 1:
The patent uses a composite sealing structure combining synthetic resin package body with additional sealing materials (such as metal seals or specialized sealing compounds) applied at critical interfaces. This composite approach compensates for the heat expansion coefficient mismatch between synthetic resin and capacitor components, preventing microvoid formation and maintaining air-tight and water-tight properties throughout temperature cycling.
2Duration of action of stationary object
If epoxy resin or organic compounds are used as package materials, then the package body is formed, but moisture absorption occurs reducing the lifetime
Solution Approach 1:
The patent applies thin film sealing layers (such as conformal coatings or vapor-deposited films) over the synthetic resin package body and at electrode pin interfaces. These thin films act as moisture barriers while being flexible enough to accommodate thermal expansion differences, preventing moisture ingress that would otherwise reduce the capacitor's lifetime.
3Reliability
If microvoids and microgaps form during package body formation, then defects occur leading to short circuit or current leakage, but these defects are difficult to detect and seal
Solution Approach 1:
The patent implements sealing procedures during the package formation process itself, applying sealing materials and conformal coatings before final assembly completion. This preliminary sealing action prevents microvoids and microgaps from forming in the first place, and allows for detection and correction of sealing issues before the product leaves the manufacturing line, ensuring electrical insulation integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves the air-tight and water-tight properties of the solid electrolytic capacitor package structure, preventing short circuits and current leakage, and extends the capacitor's lifetime, while allowing for precise control of nanofilm thickness and uniformity, suitable for complex shapes and large surfaces.
Implementation Method 1
performing a coating step for forming a nanofilm penetrating and sealing a microstructure of the solid electrolytic capacitor package structure
Data Source
AI summary
The instant disclosure provides a solid electrolytic capacitor package structure and method of manufacturing the same. The solid electrolytic capacitor package structure includes a capacitor assembly, at least one electrode pin and a package body enclosing the capacitor assembly and the electrode pin. The electrode pin includes an embedded portion enclosed by the package body and an exposed portion positioned outside the package body. The method of manufacturing the solid electrolytic capacitor package structure includes a protection step including forming a protecting film on the exposed portion; a coating step including depositing a nanomaterial on the solid electrolytic capacitor package structure to form a nanofilm, wherein the nanomaterial penetrates into defects of the solid electrolytic capacitor package structure; and a deprotection step including removing the protecting film. The instant disclosure provides improved air-tight and water-tight properties of the solid electrolytic capacitor package structure, thereby increasing the lifetime thereof.