Solid Electrolytic Capacitor Package Structure with Trimmed Conductive Terminals
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Solution Overview
Problem
Conventional solid electrolytic capacitor package structures suffer from poor sealability and reduced reliability due to voids between the package body and conductive terminals, which can lead to degradation of electrical properties and shortened lifespan when exposed to atmospheric moisture.
Innovation Solution
A method involving conductive terminals with a core and mantle layers, where a portion of the mantle layer is removed using a dry-type process like laser trimming, allowing for improved sealing by exposing the core layer surface, and the package body is designed to encapsulate the terminals with enhanced electrical contact and lead-out portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional capacitor package structure is used with complete mantle layers on conductive terminals, then the manufacturing process is simpler, but voids form between the package body and conductive terminals leading to poor sealability and reduced reliability
Solution Approach 1:
A portion of the mantle layer is removed from the conductive terminal surface through a dry-type process, exposing the core layer. This extraction creates an exposed surface that eliminates voids between the package body and terminal, significantly improving sealability and preventing moisture ingress while maintaining manufacturing feasibility
Solution Approach 2:
The mantle layer is selectively removed only from specific portions of the conductive terminal surface, creating local variations in structure. The exposed core layer surface provides enhanced sealing contact with the package body, while the remaining mantle layer maintains electrical conductivity and mechanical strength
2Reliability
If the lead-out portion is bent along the package body surface, then the electrical connection is improved and sealing is enhanced, but the terminal configuration becomes more complex
Solution Approach 1:
The lead-out portion is configured in a bent shape that follows the contour of the package body surface. This dynamic configuration allows the terminal to adapt to the package geometry, ensuring optimal electrical contact and sealing along the curved interface between the terminal and package body
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the sealing properties and reliability of the solid electrolytic capacitor package structure, preventing moisture ingress and maintaining electrical performance over time.
Implementation Method 1
removing a portion of the mantle layer from the surface of the core layer of at least one conductive terminal by a dry-type process
Data Source
AI summary
The instant disclosure relates to a method for making solid electrolytic capacitor package structure with improved conductive terminals. The first step is to provide at least one conductive terminal having an electrical contact portion and a lead-out portion. The next step is to remove a portion of mantle layer from the surface of the core layer of at least one conductive terminal by a dry-type process. The next step is to sequentially stack together a plurality of stacked-type capacitors to form a capacitor unit and then electrically connect the capacitor unit to at least one conductive terminal. The next step is to form a package body to encapsulate the capacitor unit and the electrical contact portion of at least one conductive terminal. The last step is to bend the lead-out portion of at least one conductive terminal to an axis that extends along the surface of the package body.