Vanadyl and quinone dopants increase carrier density in conductive polymers while preventing thermal deterioration for stable electronic devices.
Incorporating organic alkali into solid electrolyte layers with self-doped conductive polymers.
A solid electrolytic capacitor integrates a hydrophobic moisture barrier over the conductive polymer layer.
A decoupling device merges solid electrolyte and ceramic capacitors on a shared lead frame to deliver broadband power integrity.
Solid electrolytic capacitor material replaces organic dielectrics to achieve hundreds of uF capacitance while maintaining process yield.
A solid electrolytic capacitor package structure uses conductive terminals with a dry-type trimmed mantle layer to expose the core surface for direct encapsulation.
Hermetically sealed manganese oxide capacitor uses inert gas atmosphere to protect solid electrolyte from moisture exposure.
A solid electrolyte layer with conductive polymer and specific ions improves film formation on the anode body, reducing equivalent series resistance.
A conductive bridge enables electrochemical polymerization on a seed layer, then disconnects to prevent dielectric damage during assembly.
Gel electrolyte with thermal inhibitors prevents conductive polymer degradation during capacitor dielectric reformation.
A solid electrolytic capacitor uses a segmented silver layer with spherical particles and flakes to increase contact area.
Sequential vapor deposition creates an adhesive film between conductive polymer layers, resolving delamination and low ESR trade-offs.
Edge conductive layers join surface terminals on an insulating substrate, reducing ESR and ESL while improving solder wettability.
Bending a single metal plate creates an integral anode terminal that eliminates welding steps and prevents positional deviations during capacitor manufacturing.
Dry process deposition of a first conductive layer prevents moisture ingress during wet plating, eliminating exterior swelling and defective mounting.
Nesting a bent tantalum wire inside the capacitor body maximizes surface area and capacitance without increasing physical volume.
A conductive polymer solution forms solid electrolyte layers in capacitors.
Fluorine compound coating layer prevents wax component infiltration from outer packaging resin, minimizing characteristic changes at high temperatures.
A solid electrolytic capacitor uses a dual-layer resin structure to mechanically reinforce the anode lead connection.
Separation parts on the electrode foil distribute bending stress to prevent core part cracks while maintaining high electrostatic capacitance.
Phosphate anodizing repairs cracks in the dielectric oxide layer to reduce leakage current, maintaining reliability under high-frequency stress.
Hydrophilic polymer compound repairs oxide film defects via moisture retention, eliminating oxidizing agents that damage the dielectric layer.
Nanowire electrodes enable flexible supercapacitors that maintain structural stability for wearable electronics.
A capacitor assembly uses an intrinsically conductive polymer to maintain stable capacitance at elevated temperatures.
External anode path frees internal volume for larger pellets, increasing volumetric efficiency.
Parallel linear conductors share a single cathode structure to reduce the thickness ratio, enabling downsizing while maintaining low ESR.
A solid electrolytic capacitor uses a secondary electrical connection through the encapsulant to shorten internal current paths.
Segmented radial and axial interrupters break all electrical connections regardless of housing expansion constraints.
Resin-filled fiber sheets prevent electric discharge through the housing space, ensuring high withstand voltage and long lifetime.
A solid electrolytic capacitor uses a controlled cation ratio in its electrolyte layer to stabilize electrical conductivity.
A solid electrolytic capacitor uses a laminated nonwoven fabric separator to hold the solid electrolyte uniformly.
Inverted anode case connection with separator isolation prevents short circuits while increasing capacitance storage.
Rolling creates a terminal projection that eliminates the bolster member, resolving manufacturing precision issues in electrical connection.
Phenoxy resin conductive paste reduces curing stress, preventing cracks and improving ESR characteristics.
Hybrid conductive medium impregnates winding capacitor elements to reduce leakage current via self-repairing dielectric film defects.
Washing residual flux prevents dopant reactions that degrade ESR and leakage at high temperatures.
A conductive polymer layer uses a copolymer dopant to enhance dielectric restoration.
A cathode foil oxide coating enhances conductive polymer impregnation to reduce equivalent series resistance and increase capacitance.
Error handling circuitry detects and consumes link errors to maintain the PCIe link, preventing host crashes caused by uncorrectable faults.
Replacing tantalum with aluminum gel bodies reduces processing complexity and short-circuit risks while maintaining capacitance.
Intentional cathode misalignment in stacked solid electrolytic capacitors reduces equivalent series resistance and leakage current.
Impregnating the solid electrolyte layer with oxoacid reduces equivalent series resistance while maintaining electrostatic capacity.
Acid catalyst polymerizes heteroaromatic monomers into conjugated polymers, eliminating heavy metal contamination from traditional oxidative processes.
A conductive polymer composition with sulfonic acid groups and alkali metal hydroxides enhances electrical conductivity.
Recessed regions and a hydrophobic coating on the anode lead wire prevent delamination caused by residual moisture vaporization during capacitor manufacturing.
A composite coupling agent layer fills dielectric defects to reduce leakage current while maintaining high capacitance in solid electrolytic capacitors.
A conductive polymer composite material blends intrinsically conductive polymers with cellulose nanofibers and polyols to create solid electrolytes.
A stacked solid electrolytic capacitor package structure embeds conductive terminals with exposed portions bent along specific faces to form multiple negative lead pins.