Stacked Solid Electrolytic Capacitor Package with Multi-Face Negative Lead Pins
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Solution Overview
Problem
Existing stacked-type solid electrolytic capacitor packages face challenges in reducing Equivalent Series Inductance (ESL), particularly in high-frequency ranges, due to limitations in lead pin configurations.
Innovation Solution
The method involves forming a stacked-type solid electrolytic capacitor package structure with a plurality of negative lead pins by embedding conductive terminals within a package body, where the terminals' exposed portions are bent and extended along specific faces of the package, creating multiple negative lead pins to reduce ESL.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional single negative lead pin configuration is used, then the device complexity is low, but the Equivalent Series Inductance (ESL) is high especially in high-frequency ranges
Solution Approach 1:
The single negative lead pin is segmented into multiple negative lead pins (at least two) that are spatially separated and extend along different faces of the package body. This segmentation allows current to flow through multiple parallel paths, reducing the Equivalent Series Inductance (ESL) especially in high-frequency ranges, while maintaining a manageable device complexity through systematic arrangement.
Solution Approach 2:
The negative lead pins are extended along different spatial dimensions (different faces of the package body) rather than being confined to a single location. This dimensional distribution optimizes the current path geometry, reducing inductance by minimizing loop areas and providing multiple current return paths, thereby resolving the ESL issue without excessive complexity.
2Reliability
If multiple negative lead pins are added to reduce ESL, then the ESL reduction is achieved, but the manufacturing process complexity increases
Solution Approach 1:
The conductive terminals are embedded within the package body during the package formation process itself, rather than adding them separately afterward. This preliminary action integrates the multiple negative lead pin creation into the existing manufacturing workflow, avoiding additional complex assembly steps while achieving the ESL reduction through the multi-pin configuration.
3Reliability
If the exposed portions of conductive terminals are bent and extended along specific faces, then the total contact area of negative electrode pads is increased, but the manufacturing precision requirements increase
Solution Approach 1:
The conductive terminals are bent and extended along specific faces of the package body to create localized contact areas where needed. This local quality approach concentrates the contact area enhancement at the lead pin locations rather than requiring uniform changes throughout the entire structure, thereby increasing total contact area while managing manufacturing precision requirements through targeted modifications.
Data Source
AI summary
A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.