Embedded Capacitor Substrate Module Using Solid Electrolytic Material
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Solution Overview
Problem
Current technologies for embedding capacitors in substrates face limitations in increasing capacitance beyond 0.1 uF due to the restricted dielectric constant of organic insulating materials, leading to higher fabrication costs and reduced process yield, while also struggling to meet the demands of higher capacitance requirements for IC carrier boards.
Innovation Solution
An embedded capacitor substrate module utilizing a solid electrolytic capacitor structure with multiple layers of solid electrolytic capacitor material between substrates and a metal substrate, along with an electrode lead-out region, to enhance capacitance and reduce equivalent series inductance, allowing for higher capacitance values and broader frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the dielectric constant of organic insulating material is increased to achieve higher capacitance, then the capacitance can exceed 0.1 uF, but the process yield reduces and fabrication cost increases
Solution Approach 1:
The patent changes the material parameter from organic insulating material to solid electrolytic capacitor material, which has a higher dielectric constant and enables capacitance values exceeding 0.1 uF without requiring excessive layer multiplication, thereby maintaining acceptable process yield
Solution Approach 2:
The patent uses composite material structure combining solid electrolytic capacitor material with metal substrate and organic insulating material to achieve high capacitance while maintaining manufacturing feasibility and acceptable process yield
2Quantity of substance
If multiple layers of capacitor material are added to increase capacitance, then the capacitance can reach hundreds of uF, but the substrate thickness and area requirements increase
Solution Approach 1:
The patent changes the dielectric material to solid electrolytic capacitor material with higher dielectric constant, enabling achievement of hundreds of uF capacitance with fewer layers and reduced substrate thickness compared to conventional organic insulating materials
Solution Approach 2:
The patent embeds the capacitor structure within the substrate layers, nesting the solid electrolytic capacitor material between metal substrate and organic insulating material, achieving high capacitance without proportionally increasing overall substrate thickness
3Adaptability or versatility
If SMD capacitors are placed on the surface of IC carrier board to reduce impedance, then the frequency band can be widened, but the equivalent series inductance increases
Solution Approach 1:
The patent embeds the capacitor structure within the substrate rather than placing it on the surface, nesting it between internal layers. This embedding approach reduces the current path length and equivalent series inductance while maintaining broad frequency band adaptability
Solution Approach 2:
The patent transitions from surface-mounted (2D) capacitor placement to embedded (3D) capacitor structure, moving the capacitor into the substrate depth dimension. This dimensional change reduces the loop area and equivalent series inductance while preserving frequency response characteristics
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a large-area, high-capacitance embedded capacitor substrate module capable of delivering several nF to hundreds of uF capacitance, effectively addressing the limitations of current technologies by enabling lower ESL and wider frequency bands, thus stabilizing power systems in IC carrier boards.
Implementation Method 1
the solid electrolytic capacitor material, a part of the metal substrate and a part of the substrate form a solid electrolytic capacitor
Data Source
AI summary
An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.