Capacitor Tapered Pillars Prevent Sticking
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Solution Overview
Problem
Existing thin film capacitors face challenges in increasing capacity while maintaining a small size and minimizing manufacturing process difficulties, particularly due to issues like pillar sticking and reduced surface area, which affects their application in portable IT devices.
Innovation Solution
A capacitor design featuring pillars with a lower portion wider than the upper portion, increasing effective rigidity to prevent sticking, and a capacitor layer with a dielectric layer and electrodes alternately disposed between the pillars, along with a filler to prevent thermal expansion cracks, enhancing surface area and capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a pillar-type structure is applied to increase capacity, then the surface area implementing capacity is increased, but the formation of thin high pillars is restricted in terms of process and material
Solution Approach 1:
The patent changes the geometric parameters of the pillars by making the lower portion wider than the upper portion, creating a tapered structure. This parameter change allows the pillars to achieve sufficient mechanical support and adhesion without requiring excessive height, thereby enabling capacitance increase while remaining compatible with existing manufacturing processes and material constraints.
2Quantity of substance
If thin high pillars are formed to increase capacity, then the surface area is increased, but pillar sticking occurs
Solution Approach 1:
The patent introduces asymmetry in the pillar cross-section, making the lower portion wider than the upper portion. This asymmetric tapered shape creates a mechanical interlock effect between adjacent pillars, preventing them from sticking together during the manufacturing process while still maintaining the increased surface area needed for higher capacitance.
3Area of stationary object
If the capacitor size is minimized to reduce solder ball removal area, then the area is reduced, but the capacity increases become limited
Solution Approach 1:
The patent transitions from a two-dimensional surface area approach to a three-dimensional volumetric approach by creating tapered pillars with greater height and varying cross-section. This dimensional change allows the capacitor to achieve increased capacitance within a minimized footprint area, as the capacity is now derived from the volumetric structure rather than just the planar surface area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively increases the surface area and capacitance of the thin film capacitor, preventing pillar sticking and reducing the risk of cracks, thus enabling a more efficient and compact capacitor suitable for use in portable IT devices.
Implementation Method 1
a capacitor layer disposed on a side surface and an upper surface of each pillar and including a dielectric layer and first and second electrodes alternately disposed with the dielectric layer interposed therebetween
Data Source
AI summary
A capacitor includes a support member included in a body, a plurality of pillars disposed in an upper portion of the support member and each having a lower portion wider than an upper portion, and a capacitor layer disposed on a side surface and an upper surface of each pillar and including a dielectric layer and first and second electrodes alternately disposed with the dielectric layer interposed therebetween. Lower end portions of adjacent pillars are in contact with each other.