Capacitive Touch Panel Semiconductor Layer Optical Sensing
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Solution Overview
Problem
Conventional capacitive touch panels are limited to direct touching and cannot support remote or non-touch operation, while optical touch panels with built-in sensors occupy pixel area, affecting aperture ratio.
Innovation Solution
A capacitive touch panel structure incorporating semiconductor and insulating material layers with a second electrode layer, enabling both capacitive and optical touch functions through a semiconductor material layer that produces a depletion region and responds to light, allowing for optical triggering and finger touch control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a built-in optical sensor is directly buried on a TFT panel or CFP, then optical touch function is achieved, but pixel area is occupied and aperture ratio is affected
Solution Approach 1:
The patent divides the touch sensing function into two separate structures: a capacitive touch panel for direct contact sensing and an optical sensor array for remote/non-contact sensing. This segmentation allows each component to perform its specialized function without interfering with pixel area, as the optical sensor can be positioned separately from the display pixels.
Solution Approach 2:
The patent introduces optical sensing capability in a different spatial dimension by placing the optical sensor behind or beside the display panel rather than embedding it within the pixel structure. This dimensional relocation enables optical touch functionality without occupying pixel area, maintaining high aperture ratio while adding remote operation capability.
2Ease of operation
If conventional capacitive touch panel structure is used, then direct touching function is achieved, but remote or non-touch operation is not supported
Solution Approach 1:
The patent merges two different touch sensing technologies into a single integrated system: the capacitive touch panel for direct contact operation and the optical sensor array for remote/non-contact operation. This combination allows the device to support both direct touching and remote operation modes, significantly enhancing operational versatility while maintaining the ease of direct touch interaction.
Solution Approach 2:
The integrated touch system is designed to perform multiple functions: it can detect direct finger contact through capacitive sensing, detect remote objects or gestures through optical sensing, and distinguish between different types of interactions. This multi-functionality allows a single system to handle various operation modes including direct touch, remote operation, and non-contact gestures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The capacitive touch panel achieves both capacitive and optical touch functions with enhanced capacitance variation and sensitivity, enabling effective remote and non-touch operation without compromising pixel area.
Implementation Method 1
during an irradiation, a capacitor of depletion region of the first material layer or second material layer made of semiconductor material is produced according to a bias of the capacitor structure
Implementation Method 2
during the irradiation, a light source provides the capacitor structure with a light and a flashing frequency of the light source is greater than a threshold frequency
Data Source
AI summary
A capacitor structure of capacitive touch panel including a first electrode layer, a first material layer, a second material layer and a second electrode layer is provided. The first material layer is disposed on the first electrode layer, and the material of the first material layer is selected from one of a semiconductor material and an insulating material. The second material layer is disposed on the first material layer, and the material of the second material layer is selected from another one of the semiconductor material and the insulating material. The second electrode layer is disposed on the second material layer.