Direct tin plating on external electrodes prevents plating solution permeation and hydrogen gas generation, improving reliability.
Outer electrodes use a plated Ni intermediate layer to connect inner and outer terminals while blocking silver migration.
A capacitor structure uses semiconductor and insulating layers to enable capacitive touch control.
A barium titanate dielectric ceramic composition incorporates specific rare earth oxide ratios to enhance insulation resistance in thin layers.
Silane coupling agents modify particle surfaces to maintain electric insulation while increasing the filling rate of high dielectric inorganic particles.
Segmented ceramic dielectric films on metal foils form stacked modules that resolve volume-reliability trade-offs in compact electronic systems.
A ceramic electrical component uses a zirconium oxide-glass composite layer to reduce parasitic capacitance and provide insulation between function layers.
A multi-layer ceramic capacitor maintains permittivity by limiting Si oxide precipitation at crystal grain boundaries during the firing process.
Amorphous metal particles melt evenly to prevent glass elution and maintain connectivity during sintering.
Differentiated grain sizes in outer and inner layers of a laminated ceramic capacitor reduce residual stress and prevent peeling defects during sintering.