Multilayer Ceramic Capacitors with Segmented Dielectric Layers
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Solution Overview
Problem
Existing capacitors face challenges in miniaturization, high power applications, temperature stability, and electromagnetic interference, particularly in electronic systems requiring compact, reliable, and high-capacity components that can operate across a wide temperature range without moving parts.
Innovation Solution
The development of multi-layer capacitors with ceramic dielectric films on metal foils, allowing for stacked modules with flexible configurations, embedded in printed circuit boards, which provide high capacitance density, mechanical flexibility, and temperature stability from -55°C to 200°C, enabling compact, reliable, and efficient energy storage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional capacitor designs are used, then capacitance can be achieved, but the device size and volume are large, preventing miniaturization
Solution Approach 1:
The capacitor is divided into multiple thin layers of dielectric film and electrode foil stacked together. This segmentation allows the capacitor to achieve high capacitance in a compact volume while maintaining thermal stability through the distributed structure of multiple thin layers rather than a single thick component.
Solution Approach 2:
The invention transitions from traditional single-layer or few-layer capacitor structures to a multi-layer stacked configuration. By adding the dimension of multiple stacked layers, the capacitor achieves high capacitance density in a small volume while the distributed layer structure improves heat dissipation and temperature stability.
2Power
If capacitor power handling is increased for high power applications, then power capacity improves, but the device generates more heat and requires cooling systems
Solution Approach 1:
The capacitor structure segments the power handling function across multiple thin dielectric layers and electrode foils. This distribution of the electrical stress and heat generation across many thin layers improves heat dissipation efficiency, allowing high power handling without excessive temperature rise that would require separate cooling systems.
Solution Approach 2:
The invention uses composite structures combining thin dielectric films with metal electrode foils. This composite material approach optimizes both power handling capacity and thermal management, as the thin-layer composite structure provides high capacitance density while the distributed architecture facilitates heat dissipation, enabling high power operation without additional cooling systems.
3Adaptability or versatility
If fixed capacitor structures are used, then manufacturing is simple, but capacitance cannot be varied
Solution Approach 1:
The capacitor is constructed from multiple discrete layers of dielectric film and electrode foil that can be independently controlled during manufacturing. This segmentation allows for variable capacitance by adjusting the number of layers, the area of overlapping electrodes, or the thickness of individual layers, providing capacitance variability while maintaining a relatively simple stacked structure.
Solution Approach 2:
The invention enables variable capacitance through a monolithic stacked structure where the effective capacitance can be adjusted by changing the electrical connection configuration of the internal layers. This dynamic capability is achieved within a fixed physical structure, allowing capacitance variation without mechanical moving parts, thus maintaining structural simplicity while achieving adaptability.
4Volume of moving object
If capacitor layers are made thinner to reduce volume, then miniaturization is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The capacitor volume is reduced by segmenting the structure into multiple thin layers. While each individual layer is thin, the segmentation approach allows standard manufacturing techniques to be applied to each layer, making the thin-film fabrication process more manageable and less demanding than attempting to create a single thick layer with the same total capacitance.
Solution Approach 2:
The invention achieves volume reduction through parameter changes in the layer thickness and number of layers. By optimizing these parameters within the capabilities of existing manufacturing processes, the design attains miniaturization while maintaining manufacturability. The thin-film parameters are selected to balance volume reduction with the precision capabilities of current deposition and lamination technologies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables capacitors with high capacitance density, mechanical flexibility, and temperature stability, reducing electromagnetic interference and inductance loss, while allowing for multiple voltage and capacitance configurations without moving parts, thus addressing the need for compact, reliable, and efficient energy storage in electronic systems.
Implementation Method 1
ceramic dielectric films on metal foils
Implementation Method 2
ceramic chemically deposited on the first electrically conductive surface
Data Source
AI summary
The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC.