Monolithic Ceramic Capacitor Varying Conductor Density Delamination
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Solution Overview
Problem
Monolithic ceramic capacitors face delamination issues due to differences in contraction between conductor and ceramic dielectric layers, leading to reduced reliability and yield in manufacturing.
Innovation Solution
The capacitors are designed with a configuration where the conductor density of outermost layers is lower than the inner layers, and these layers include fine through holes filled with ceramic dielectric material, reducing the likelihood of delamination by providing a fixing force between the layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the conductor density is increased to increase the facing area and capacity, then the capacity of the monolithic ceramic capacitor is increased, but delamination is more likely to occur between the multilayer portion and outer layer portions
Solution Approach 1:
The patent applies local quality by differentiating conductor density across different regions of the capacitor. The multilayer portion has high conductor density for maximum capacity, while the outer layer portions have reduced or no conductor patterns. This local differentiation allows each region to optimize its function: the inner multilayer portion maximizes capacitance through high conductor density, while the outer portions minimize thermal contraction stress that causes delamination.
2Quantity of substance
If the continuity of conductor layers is increased to increase the facing area, then the capacity is increased, but the difference in contraction between conductor layer and ceramic dielectric layer causes delamination
Solution Approach 1:
The patent segments the conductor layer continuity by introducing interruptions or reduced conductor patterns in the outer layer portions. This segmentation breaks the continuous conductor path that would otherwise create uniform thermal contraction stress, thereby reducing delamination risk while maintaining adequate capacitance through the high-density conductor layers in the multilayer portion.
3Ease of manufacture
If thermal history is applied during manufacturing, then the capacitor is formed, but thermal history acts as shear force at boundary portions causing delamination
Solution Approach 1:
The patent applies preliminary anti-action by pre-designing the conductor layer configuration to counteract the harmful effects of thermal history. By reducing conductor density in outer layers before manufacturing, the design preemptively compensates for the shear forces that will occur during thermal processing, preventing delamination before it happens.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively increases the capacity of the capacitors while significantly reducing delamination, thereby enhancing product reliability and manufacturing yield.
Implementation Method 1
these layers include fine through holes filled with ceramic dielectric material, reducing the likelihood of delamination by providing a fixing force between the layers
Implementation Method 2
a monolithic ceramic capacitor includes an element body including therein a multilayer portion including a plurality of conductor layers and a plurality of ceramic dielectric layers alternately stacked
Data Source
AI summary
A monolithic ceramic capacitor includes an element body having therein a multilayer portion formed of a plurality of conductor layers and a plurality of ceramic dielectric layers alternately stacked in a thickness direction; and a first outer electrode and a second outer electrode provided on an outer portion of the element body. The element body is divided in the thickness direction into a thickness-direction first outer layer portion, a thickness-direction second outer layer portion, and a thickness-direction inner layer portion located between the thickness-direction first outer layer portion and the thickness-direction second outer layer portion and including the multilayer portion. A first conductor layer and a second conductor layer, which are outermost layers among the plurality of conductor layers, have lower conductor densities than any of conductor densities of the other conductor layers.