Capacitor Wire Structure for Easier Wire-Bonded Mounting
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Solution Overview
Problem
The challenge of reducing the size of multi-layer ceramic capacitors while maintaining their functionality and ease of mounting on electronic device substrates is hindered by fabrication and mounting difficulties.
Innovation Solution
A capacitor wire design featuring a core electrode line, an outer electrode line with a lower melting point, a dielectric line, and a passivation line, allowing for easy mounting via wire bonding, which includes a core electrode line with a wire shape, an outer electrode line covering the core, and a dielectric line interposed between them, with the outer electrode line having a lower melting point than the core.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multi-layer ceramic capacitor size is reduced, then integration density improves, but fabrication and mounting difficulty increases
Solution Approach 1:
The capacitor is segmented into distinct functional layers (core electrode line, dielectric line, outer electrode line) that can be independently fabricated and then assembled. This segmentation allows each layer to be optimized separately and simplifies the mounting process as the segmented structure can be attached to substrates more easily than monolithic small capacitors.
Solution Approach 2:
The capacitor structure employs nesting where the outer electrode line covers and encloses the core electrode line, with the dielectric line interposed between them. This nested configuration allows compact integration while maintaining clear structural boundaries that facilitate manufacturing and mounting processes.
2Ease of operation
If outer electrode line melting point is lowered, then wire bonding ease improves, but thermal stability may deteriorate
Solution Approach 1:
The capacitor structure employs different material properties at different locations: the outer electrode line uses material with lower melting point for ease of wire bonding at the bonding location, while the core electrode line and dielectric line use materials with higher thermal stability for operational reliability. This local differentiation of material properties resolves the contradiction between bonding ease and thermal stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of smaller, highly-integrated electronic devices with improved mounting capabilities and functionality by utilizing a capacitor wire that can be easily connected to substrate pads using wire bonding methods.
Implementation Method 1
The outer electrode line may include material having a melting point lower than a melting point of material of the core electrode line
Data Source
AI summary
A capacitor wire includes a core electrode line provided in the form of a wire, an outer electrode line covering at least a portion of the core electrode line, and a dielectric line interposed between the core electrode line and the outer electrode line. The outer electrode line comprises material having a melting point lower than material of the core electrode line.