Capillary Heat Dissipation Plate Against Gravity
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Solution Overview
Problem
Conventional heat dissipation devices fail to effectively dissipate heat from electronic components located above the surface of the coolant due to gravitational forces, which hinder the circulation of coolant and subsequent heat dissipation.
Innovation Solution
A heat dissipation plate with a capillary structure is designed, featuring inclined grooves and longitudinal grooves that allow coolant to flow against gravity, ensuring efficient heat transfer from heat sources located both above and below the coolant surface by utilizing a capillary structure that extends from below to above the coolant surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation devices use gravity-dependent coolant circulation, then heat dissipation from heat sources below the coolant surface is effective, but heat dissipation from heat sources above the coolant surface fails due to gravitational forces hindering coolant circulation
Solution Approach 1:
The patent replaces the gravity-dependent mechanical circulation system with a capillary-driven system. The capillary structure utilizes surface tension forces at the micro-scale to drive coolant circulation, eliminating dependence on gravitational forces. This allows coolant to flow upward to heat sources above the coolant surface while maintaining circulation effectiveness for heat sources at any position.
Solution Approach 2:
The patent employs a capillary structure with porous or micro-channeled geometry that enables capillary action. The porous material creates sufficient capillary pressure to overcome gravitational forces, allowing coolant to be drawn upward against gravity to reach heat sources located above the coolant surface, thereby resolving the position-dependent heat dissipation limitation.
2Ease of operation
If coolant is contained entirely below the surface, then gravitational circulation works for below-surface heat sources, but above-surface heat sources cannot be cooled effectively
Solution Approach 1:
The patent extends the coolant circulation system into the vertical dimension by incorporating a capillary structure that reaches from below the coolant surface up to above it. This dimensional extension allows the system to access heat sources at multiple vertical positions, transforming a single-level cooling system into a multi-level system capable of handling heat sources throughout the device volume.
Solution Approach 2:
By replacing gravity-dependent circulation with capillary-driven circulation, the system gains adaptability to heat sources at any vertical position. The capillary forces provide position-independent coolant delivery, enabling the system to effectively cool heat sources whether they are below, at, or above the coolant surface level.
3Adaptability or versatility
If capillary structure extends from below to above the coolant surface, then heat dissipation from heat sources at any location is enabled, but device complexity increases
Solution Approach 1:
The patent merges the capillary structure with the existing heat dissipation plate body, integrating the coolant circulation function directly into the structural component. This integration approach combines multiple functions (structural support and capillary-driven coolant delivery) into a single element, reducing overall device complexity while maintaining the ability to cool heat sources at any vertical position.
Solution Approach 2:
The heat dissipation plate is designed with multi-functionality by incorporating the capillary structure that serves both as part of the structural framework and as the coolant circulation pathway. This universal design allows the same component to provide mechanical support and thermal management across multiple vertical levels, eliminating the need for separate circulation systems and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The capillary structure enables efficient coolant circulation and heat dissipation from heat sources regardless of their location relative to the coolant surface, enhancing the heat dissipation efficiency by allowing coolant to flow against gravity and reducing the circulation path for heat dissipation.
Implementation Method 1
a capillary structure (300) disposed between the first plate (100) and the second plate (200), the capillary structure (300) extending from below a surface of the coolant (L) to above the surface of the coolant (L)
Implementation Method 2
When the heat dissipation plate is in thermal contact with a heat source, such as an electrical component, the coolant in the circulation channel absorbs heat generated by the electronic component to cool the electronic component
Data Source
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AI summary
A heat dissipation device includes a first plate having a first plurality of angled grooves arranged in a first direction, and a second plate having a second plurality of angled grooves arranged in the first direction. The second plate is coupled to the first plate, at least portions of the first plurality of angled grooves and the second plurality of angled grooves are connected to each other such that the first plurality of angled grooves and the second plurality of angled grooves define a fluid channel of the heat dissipation device, and the fluid channel includes coolant. The heat dissipation device also includes at least one capillary structure. At least a portion of the fluid channel is covered by the at least one capillary structure.