Indirect Heat Exchangers TRIZ Cases

Cut-off openings in channel walls distribute vapor efficiently, reducing liquid flow friction and preventing dry-out at high heat loads.

A porous heat exchanger creates a positive flow boundary layer to sublimate solid carbon dioxide particles within the casing.

An inner pipe separates fluid channels in a heat pipe to prevent interference between phases and improve cooling efficiency.

Silicon carbide and silicon dioxide coating releases heat radiation in the 7.9 to 13.0 micrometer range.

Variable wall thickness in the capillary structure overcomes gravity-induced fluid return failures, maintaining effective cooling circulation.

Embedding a fiber wick in a sintered metal powder matrix reduces pressure loss while maintaining capillary action for efficient heat transfer.

Induction coupling powers a rotating display circuit, eliminating external wiring complexity while enabling dynamic program updates.

Coolant circulation cools rocket engines and transfers waste heat to propellant tanks, maintaining pressure for consistent feeding.

Stacked perforated and grooved plates separate vapor and liquid channels in an artery heat pipe to enable efficient fluid circulation.

Segmented wick sheet design with spaced lands and vapor passages resolves insufficient heat dissipation uniformity across wide regions.

Composite ceramic foam absorbs heat via phase change, preventing erosion and recession in extreme thermal environments.

A heat pipe device uses gas pressure to push liquid upward through a capillary structure against gravity.

A dual vapor chamber system transfers thermal energy between relatively rotated electronic components via an intermediary heat transfer structure.

Double process ports allow simultaneous vacuumization and inert gas passage, ensuring high purity alkali metal filling without oxidation.

A polymer housing integrates metal foam to enhance thermal conductivity while reducing manufacturing costs.

Varying the fluid supply manifold cross-section directs greater coolant flow to hotter regions, eliminating complex valving for differential heating.

Direct convective cooling channels manage antenna temperatures, preventing healthy tissue necrosis during microwave ablation.

A thermal module base seat uses mechanical protrusions to form a radial interlock with the heat pipe.

Internal fin channels act as pulsating heat pipes, enabling self-driven fluid circulation that overcomes insufficient cooling in horizontal orientations.

A closed-loop liquid cooling system uses a curvilinear heat exchanger to extract thermal energy from electrical components.

Feedback-based saturation temperature control prevents cavitation and reduces thermoelastic fatigue in dissipative equipment.

A heat pipe assembly merges porous media wicks with axial grooves to transform high heat fluxes into transportable thermal energy.

A nested heat pipe structure uses methyl alcohol and pure water to enable continuous phase change heat transfer across varying temperatures.

Rolling a sintered metal compact controls void ratio in sheet-shaped wicks, resolving manufacturing difficulties in forming precise capillary structures.

Embedded oscillating heat pipes remove heat from stator windings, eliminating external cooling jackets and reducing generator weight.

A capillary heat sink integrates porous supporting portions within the casing to enhance fluid transport and structural integrity.

Nanowire microstructures enable high heat flux dissipation in compact devices by leveraging phase transitions and capillary action within sealed casings.

Capillary action drives coolant against gravity to cool heat sources above the liquid surface, resolving gravitational circulation limits.

Arrayed thorny columns on a base section provide capillary attraction to overcome slow fluid flow and structural swelling in vapor chambers.

A vehicle heat exchanger uses an adhesive system to bond a manganese-magnesium aluminum core with a protective plating layer.

An anhydrous heat transfer medium circulates via thermosiphon to remove thermal energy without external work.

Porous inserts in heat pipe evaporators reduce thermal resistance while increasing capillary pumping limits.

Side retracted portions on a vapor chamber allow hook attachment, resolving low-profile conveyability issues.

A solar panel cooling plate uses vertical air channels to dissipate heat via natural convection without external power.

A heat sink places the heat pipe inside the base portion to improve thermal connectivity.

Self-service geometric features dislodge dust particles from the cooling surfaces, maintaining thermal performance without external cleaning systems.

Grooves in the wick structure connect opposite chamber walls to maintain vapor and liquid circulation efficiency despite reduced device thickness.

Interleaved concentric fins transfer heat between rotating and stationary plates, resolving overheating in high-power rotary devices.

Snap-fastened elastic seals adapt to varying pipe diameters, preventing air leakage during rapid charging.

Adjusting joint angles and support spacing in a vapor chamber resolves poor reliability caused by insufficient heat transfer.

Concentric nesting of two heat pipes reduces thermal resistance and improves heat dissipation for multiple sources.

Axial capillary structure in tubular body directs cooled working fluid back into the case chamber.

Heat pipes link downstream and upstream server heat sinks, transferring thermal energy from hotter zones to cooler ones to balance operating temperatures.

Integral internal support plate reinforces thin-walled heat transport member against atmospheric pressure without adding weight.

An integrated heat sink merges primary and remote zones via conduction paths, directing airflow to cool multiple sources without blocking ventilation.

A pulsating heat pipe uses a specific chamber hydraulic diameter to enable capillary fluid circulation without gravity assistance.

Insulating walls divide a vapor chamber into isolated sections, preventing thermal crosstalk between heat generating components.

A heat conduction device uses segmented temperature control sections connected by distinct heat transfer portions to manage thermal energy distribution.

A loop heat pipe vapor pipe features a thin wall portion that expands under internal pressure to maintain fluid flow during bending.

A heatsink plate with a slot connects a first vapor chamber to a fin-encompassed second vapor chamber for fluid flow.