Heat Pipe Heatsink Internal Support Plate Pressure Resistance
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Solution Overview
Problem
Conventional heat sinks for electronic components face challenges in achieving sufficient cooling performance due to uneven heat reception by heat pipes, deformation under atmospheric pressure, and increased weight for pressure resistance, which impairs thermal connectivity and component performance.
Innovation Solution
A heat sink design featuring a lightweight heat transport member with an integral internal space filled with a working fluid, a supporting member with flat plate portions, and a pipe body connected to a heat radiating fin group, which allows for equalized heat input and improved pressure resistance without obstructing gas-phase fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the container of the heat transport member is provided with sufficient thickness to give pressure resistance against atmospheric pressure, then pressure resistance is improved, but weight is increased and stress is applied to the electronic component
Solution Approach 1:
The heat transport member is divided into multiple heat pipes arranged in parallel, each with its own container. This segmentation allows each individual container to have reduced thickness while collectively providing sufficient pressure resistance through the distributed structure. The supporting member further segments the internal space to prevent deformation.
Solution Approach 2:
A supporting member is introduced as an intermediary element inside the heat transport member's container. This supporting member reinforces the container's pressure resistance against atmospheric pressure without requiring increased container thickness, thereby preventing deformation while avoiding direct stress application to the electronic component.
2Strength
If a solid columnar member or block member is housed in the entire internal space of the container to give pressure resistance, then pressure resistance is improved, but weight is increased and stress is applied to the electronic component
Solution Approach 1:
The container is designed as a thin-walled structure that relies on its geometric configuration and the internal supporting member rather than thick walls for pressure resistance. This allows the container to maintain structural integrity against atmospheric pressure while minimizing weight and stress transmission to the electronic component.
3Strength
If the container thickness is increased to prevent deformation, then pressure resistance is improved, but thermal connectivity between heating element and heat receiving portion is impaired
Solution Approach 1:
The heat transport member is segmented into multiple thin-walled heat pipes rather than one thick-walled container. This segmentation maintains thermal connectivity through the thinner walls while collectively providing the necessary pressure resistance, preventing deformation that would impair thermal contact.
4Strength
If a solid columnar member or block member is housed in the entire internal space of the container, then pressure resistance is improved, but flow of gas-phase working fluid is blocked
Solution Approach 1:
The container is designed as a thin-walled structure that provides pressure resistance without internal solid blocks. This allows the gas-phase working fluid to flow freely through the entire internal space, maintaining heat transport productivity while achieving sufficient pressure resistance through the container's geometric configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances cooling performance by equalizing heat input, reducing thermal resistance, and providing pressure resistance against atmospheric pressure without increasing the heat sink's weight or obstructing fluid flow, thus improving the stability and efficiency of electronic component cooling.
Implementation Method 1
a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member
Implementation Method 2
a heatsink including a heat transport member having an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid
Implementation Method 3
a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged
Implementation Method 4
to radiate the heat from the heat radiating fin
Data Source
AI summary
A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, a heat receiving portion inner surface area increasing portion and a supporting member are provided in an internal space of the heat receiving portion, and the supporting member is in surface contact with the heat receiving portion inner surface area increasing portion.