Thin Heat Pipe With Grooved Wick For Flexible Cooling
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Solution Overview
Problem
Conventional heat pipes and vapor chambers are ineffective in thin electronic devices due to limited internal space and rigidity, which hampers heat dissipation and vapor/liquid circulation, especially in curved wearable devices.
Innovation Solution
A thin heat pipe structure with a wick structure and working fluid, featuring grooves that connect opposite walls and extend along the length and thickness directions to facilitate smooth vapor/liquid circulation, allowing for flexibility and efficient heat dissipation in narrow spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat pipes or vapor chambers are used, then heat dissipation performance is improved, but device thickness increases and flexibility is lost
Solution Approach 1:
The patent applies this principle by constructing the heat pipe with extremely thin wall structures (first and second plate members) that enable flexibility and bending capability. The thin-walled chamber allows the heat pipe to conform to curved surfaces in wearable devices while maintaining effective heat dissipation functionality.
Solution Approach 2:
The patent extends the condensing section towards the ends of the evaporating section along the length direction, creating a three-dimensional vapor/liquid circulation pathway that compensates for the reduced thickness dimension. This dimensional redistribution maintains circulation efficiency despite the thin overall structure.
2Length of moving object
If heat pipe thickness is reduced, then device thinness is achieved, but vapor/liquid circulation efficiency deteriorates
Solution Approach 1:
The patent compensates for the reduced thickness by extending the condensing section along the length direction towards the evaporating section ends. This creates an elongated circulation pathway that maintains sufficient vapor and liquid transport distance despite the thin overall structure.
Solution Approach 2:
The wick structure is nested within the thin-walled chamber, with grooves formed directly in the wick material. This nested arrangement maximizes the use of available internal space for vapor/liquid circulation pathways without increasing external dimensions.
3Temperature
If conventional rigid heat pipes are used, then heat dissipation structure is provided, but adaptability to curved surfaces is lost
Solution Approach 1:
The patent employs thin-walled plate members that inherently possess flexibility, allowing the heat pipe to bend and conform to curved surfaces. This flexible construction enables adaptation to wearable device geometries while maintaining the heat dissipation structure.
Solution Approach 2:
The heat pipe structure transitions from a rigid configuration to a dynamic, flexible form that can adapt its shape. The thin-walled construction allows the heat pipe to deform elastically and conform to various curved surfaces without compromising structural integrity or heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances vapor/liquid circulation and heat dissipation performance, enabling effective cooling in thin, flexible, and curved devices by maintaining internal space and accommodating narrow spaces.
Implementation Method 1
The chamber has a wick structure and a working fluid provided therein, and internally defines an evaporating section and at least one condensing section
Implementation Method 2
The chamber has a wick structure and a working fluid provided therein, and internally defines an evaporating section and at least one condensing section
Implementation Method 3
The wick structure is provided with at least one groove. The groove is extended through the wick structure along a thickness direction of the main body to connect to two opposite wall surfaces of the chamber
Data Source
AI summary
A thin heat pipe structure includes a main body having a chamber. The chamber has a wick structure and a working fluid provided therein, and internally defines an evaporating section and at least one condensing section. The condensing section is extended towards at least one or two ends of the evaporating section. The wick structure is provided with at least one groove. The groove is extended through the wick structure along a thickness direction of the main body to connect to two opposite wall surfaces of the chamber, and also extended along a length direction of the main body to communicate with the condensing section and the evaporating section. With these arrangements, the thin heat pipe structure has an extremely small overall thickness and is flexible.