Nested Heat Pipe Module for Multi-Source Thermal Dissipation
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Solution Overview
Problem
In smaller, lighter, and thinner electronic devices, the heat dissipation efficiency is compromised due to increased heat resistance and limited space for cooling units, which affects the ability to effectively transfer heat from multiple heat sources.
Innovation Solution
A heat pipe module comprising a first pipe body with a larger surface area and a second pipe body, where the external wall of the second pipe body contacts the inner wall of the first pipe body, and a capillary structure facilitates heat transfer between them, reducing heat resistance and enhancing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of cooling units is increased to handle multiple heat sources, then heat dissipation capability is improved, but device complexity and space consumption increase
Solution Approach 1:
The patent combines multiple heat dissipation functions into a single integrated heat pipe module. The first heat pipe accommodates the second heat pipe within its hollow chamber, creating a nested structure where one cooling unit serves multiple heat sources. This merging approach maintains effective heat dissipation for multiple heat sources while reducing the overall number of separate cooling units required.
Solution Approach 2:
The patent implements a nested configuration where the second heat pipe is positioned inside the hollow chamber of the first heat pipe. The external wall of the second heat pipe directly contacts the internal wall of the first heat pipe, creating a concentric arrangement. This nesting allows the smaller heat pipe to serve additional heat sources while the larger heat pipe handles primary heat dissipation, effectively multiplying the heat dissipation capability within a single structural footprint.
2Adaptability or versatility
If the distance between cooling unit and heat source is increased to accommodate layout requirements, then device adaptability is improved, but heat transfer ability decreases
Solution Approach 1:
By nesting the second heat pipe within the first heat pipe, the invention creates a compact concentric structure that minimizes the distance between heat sources and cooling surfaces. The direct contact between the external wall of the second heat pipe and the internal wall of the first heat pipe ensures efficient thermal coupling, maintaining high heat transfer ability while providing flexible adaptability for various device layouts.
Solution Approach 2:
The invention transitions from a planar arrangement of separate heat pipes to a three-dimensional nested configuration. This spatial reorganization allows heat dissipation components to be stacked vertically or concentrically, reducing the horizontal distance between heat sources and cooling units while improving layout adaptability in constrained spaces.
3Reliability
If heat resistance is reduced to improve heat transfer efficiency, then heat dissipation performance is improved, but manufacturing precision requirements increase
Solution Approach 1:
The nested configuration with direct contact between the second heat pipe's external wall and the first heat pipe's internal wall creates a large contact surface area. This extensive contact area compensates for moderate manufacturing tolerances, ensuring low thermal resistance and efficient heat transfer without requiring extremely precise manufacturing. The concentric design naturally distributes contact pressure and maintains thermal coupling.
Solution Approach 2:
By moving from a single-plane contact interface to a three-dimensional nested contact structure, the invention increases the surface area of thermal contact between heat pipes. This multi-dimensional contact approach reduces heat resistance by providing multiple parallel thermal pathways, while the self-aligning nature of the nested structure reduces sensitivity to manufacturing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively decreases heat resistance and improves heat transfer efficiency by allowing heat to be transferred from the first pipe body to the second pipe body through the capillary structure, enabling better heat dissipation in electronic devices with multiple heat sources.
Implementation Method 1
The capillary structure (wick) in the heat pipe can transport the liquid working fluid back to the vaporization section
Implementation Method 2
In the vaporization section, the working fluid is vaporized to carry a lot of heat away
Implementation Method 3
The operation theory of heat pipe is to transfer energy by the latent heat of phase changes of the working fluid
Implementation Method 4
the vapor of the working fluid can fulfill the entire vacuum chamber of the pipe and be condensed into liquid at the condensation section to release heat
Implementation Method 5
the vapor of the working fluid can fulfill the entire vacuum chamber of the pipe and be condensed into liquid at the condensation section to release heat
Implementation Method 6
an external wall of the part of the second pipe body directly contacts the first pipe body
Data Source
AI summary
A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.