Capillary Refrigerant Panel Cooling for Compact Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation systems for electronic devices, particularly those using aluminum alloys, face limitations in thermal conductivity, material cost, and the need for expensive alternatives like copper and gold, while refrigerant-based systems face challenges with chemical reactions and environmental regulations, leading to inefficient heat dissipation and increased product size.
Innovation Solution
An active heat dissipation apparatus utilizing a thermal conduction panel body with a refrigerant flow space, incorporating a refrigerant flow path and absorber to enhance heat transfer through phase change, allowing the use of less expensive materials like stainless steel and water as refrigerants, while maintaining effective heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy materials are used for heat dissipation fins, then thermal conductivity is improved, but material cost increases and chemical reactions with refrigerants occur
Solution Approach 1:
The patent introduces a coating layer as an intermediary between the aluminum alloy heat dissipation fin and the refrigerant. This coating prevents direct chemical contact while allowing thermal energy transfer, thereby eliminating harmful chemical reactions between aluminum and refrigerants such as R-134a or R-1234yf, while preserving the high thermal conductivity of aluminum.
2Temperature
If copper or gold materials are used for heat dissipation fins, then thermal conductivity is improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent creates a composite structure combining aluminum alloy (for cost-effectiveness and adequate thermal conductivity) with a protective coating layer (for chemical resistance). This composite approach achieves performance comparable to copper or gold while maintaining significantly lower manufacturing costs, making it suitable for mass production in automotive air conditioners.
3Temperature
If refrigerant flow space is added to improve heat dissipation, then heat transport ability is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation fin structure with the refrigerant flow channel into a single integrated component. The refrigerant flows through channels formed within the fin structure itself, combining the functions of heat transfer and refrigerant circulation. This integration improves heat transport ability while avoiding the complexity of separate systems, as the fin structure serves dual purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved heat dissipation performance, reduced manufacturing costs, and compliance with environmental regulations by maximizing heat transport ability and minimizing thermal concentration, even with materials of lower thermal conductivity, such as stainless steel.
Implementation Method 1
an absorber disposed in the first refrigerant flow path and configured to raise at least the liquid refrigerant in the refrigerant to a side above an absorption point by using a capillary force or absorbency
Implementation Method 2
a first refrigerant flow path positioned adjacent to a press-fitting portion provided in a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase
Data Source
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AI summary
The present disclosure relates to an active heat dissipation apparatus and a method of manufacturing the same, the active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, in which the refrigerant flow space includes a first refrigerant flow path positioned adjacent to a press-fitting portion provided in a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and an absorber disposed in the first refrigerant flow path and configured to raise at least the liquid refrigerant in the refrigerant to a side above an absorption point by using a capillary force or absorbency, thereby significantly improving heat dissipation performance.