Capillary Trap-Vapor Pump for High Heat Flux Dissipation
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Solution Overview
Problem
High-performance electronic systems, such as microprocessors, face significant heat dissipation challenges due to increased heat fluxes in smaller package sizes, leading to the need for efficient heat management solutions that prevent surface dry-out and effectively transfer heat from hot spots.
Innovation Solution
The capillary trap-vapor pump system utilizes a contoured cavity with a capillary opening to evaporate a fluid and form a vapor bubble, which is stabilized through oscillations, allowing for efficient vapor removal and enhanced heat transfer by maintaining a thin liquid film, even at high heat fluxes, using hydrophilic and hydrophobic surface properties to manage the vapor bubble and liquid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the package size is decreased to provide more powerful systems in smaller sizes, then the power density increases, but the heat dissipation area decreases leading to higher heat fluxes
Solution Approach 1:
The patent utilizes phase change of the coolant from liquid to vapor during evaporation at the heated interface, enabling high heat flux removal through latent heat absorption. The vapor bubble formation and collapse cycle continuously absorbs and transports heat from the hot spot area.
Solution Approach 2:
The invention transitions from two-dimensional planar heat dissipation to three-dimensional vapor bubble dynamics within the cavity, utilizing vertical vapor transport through the capillary tube to enhance heat removal efficiency in limited space.
2Device complexity
If conventional heat dissipation methods are used, then the system structure is simple, but surface dry-out occurs at ultra high local heat fluxes
Solution Approach 1:
The patent applies different surface properties to different regions: the heated interface surface is made hydrophilic to promote liquid spreading and prevent dry-out, while the capillary tube and vapor removal path are designed with hydrophobic characteristics to facilitate vapor escape. This localized surface property differentiation ensures reliable heat dissipation at high fluxes.
Solution Approach 2:
The capillary tube acts as an intermediary structure that selectively transports vapor away from the heated interface while maintaining liquid supply. The tube's hydrophobic coating creates a vapor-selective pathway that prevents liquid blockage while enabling efficient vapor removal.
3Reliability
If a capillary trap-vapor pump system is implemented to prevent surface dry-out, then heat dissipation reliability improves, but device complexity increases
Solution Approach 1:
The system is designed to be self-regulating through natural capillary forces and vapor pressure gradients. The hydrophilic-heated interface automatically replenishes liquid, while vapor pressure differential drives vapor removal through the capillary tube without external pumping, achieving reliable heat dissipation with minimal active components.
Solution Approach 2:
The invention integrates multiple functions into a single compact cavity structure: liquid distribution, vapor generation, vapor removal, and liquid replenishment all occur within the same integrated component, reducing overall system complexity despite enhanced functionality.
4Power
If the heat flux is increased to provide more power in smaller packages, then power density improves, but the risk of surface dry-out increases
Solution Approach 1:
The patent changes the surface energy parameters of different components: the heated interface is made hydrophilic (low contact angle) to enhance liquid wetting and spreading, while the capillary tube is made hydrophobic (high contact angle) to facilitate vapor formation and removal. This parameter differentiation enables high heat flux operation without dry-out.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat dissipation of high heat fluxes (up to 1 kW/cm2) without surface dry-out, providing self-regulation, efficient cooling, and compact integration, suitable for high-performance electronics by stabilizing vapor bubbles and extending the area of heat dissipation.
Implementation Method 1
the heated interface surface causes the fluid to evaporate and form a vapor bubble within the contoured cavity
Implementation Method 2
a capillary opening disposed above the heated interface surface, wherein the capillary opening is the opening of a capillary tube, wherein the capillary opening forms a top boundary of the contoured cavity
Data Source
AI summary
Capillary trap-vapor pumps, systems, methods of heat management, and the like, are disclosed.