Enclosed MEMS Cavities With Suspended Component Supports
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Solution Overview
Problem
There is a need for improved structures that can be readily integrated into electronic and micro-electro-mechanical systems (MEMS) with enhanced performance, particularly in enclosed cavities that allow for mechanical isolation and efficient integration of components.
Innovation Solution
The development of enclosed cavity structures with a cap disposed over the cavity, where components can be supported by component supports extending from the cavity floor or walls, and the cavity can be formed with non-orthogonal angles using anisotropic etching, allowing for the integration of MEMS components such as acoustic wave transducers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are assembled on the substrate using individually packaged surface-mount integrated-circuit devices, then device performance is improved, but device size and integration density worsen
Solution Approach 1:
The patent extracts components from the substrate plane by creating enclosed cavities that house components in three-dimensional space. Components are suspended within cavities using support structures, removing them from the traditional two-dimensional surface-mount configuration and enabling higher integration density without compromising performance.
Solution Approach 2:
The invention transitions from two-dimensional surface-mount assembly to three-dimensional cavity-based integration. By utilizing vertical space within enclosed cavities and suspending components above the substrate, the patent enables components to be positioned in multiple spatial dimensions, significantly increasing integration density while maintaining individual component performance.
2Area of stationary object
If thin-film circuits are used to reduce device size, then integration density is improved, but device performance worsens
Solution Approach 1:
The patent applies local quality by providing high-performance individual components in critical locations within enclosed cavities while using thin-film circuits for less demanding interconnect and support functions. This heterogeneous integration allows premium components to deliver superior performance where needed while maintaining compact overall device size.
3Reliability
If components are enclosed in cavities with caps, then mechanical isolation is improved, but manufacturing complexity worsens
Solution Approach 1:
The patent segments the device into modular enclosed cavity units, each with its own cap and suspended components. This segmentation allows for standardized manufacturing processes that can be replicated across multiple cavities, reducing overall manufacturing complexity despite the added feature of mechanical isolation. Each cavity acts as an independent module that can be fabricated using similar process steps.
4Adaptability or versatility
If non-orthogonal cavity angles are used, then MEMS component integration is improved, but manufacturing precision requirements worsen
Solution Approach 1:
The patent utilizes parameter changes by employing anisotropic etching processes that exploit crystallographic orientation to create specific non-orthogonal cavity angles. By selecting appropriate crystal orientations and etching conditions, the desired cavity geometries are achieved through material property variations rather than complex mechanical machining, thereby managing precision requirements through process parameter optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of small, highly integrated MEMS structures with mechanical isolation, allowing components to move freely within the cavity without contacting the substrate, enhancing performance and integration into electronic systems.
Implementation Method 1
enclosed cavity structures with a cap disposed over the cavity, where components can be supported by component supports extending from the cavity floor or walls
Implementation Method 2
the cavity can be formed with non-orthogonal angles using anisotropic etching
Data Source
AI summary
An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.