Carbon-Coated Copper Power Plane for Reduced Loss
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Solution Overview
Problem
Current power planes in printed circuit boards experience high power loss due to excessive current density, which is beyond maximum in present core routing and switching products, especially at operational temperatures above 130° C for high-power designs.
Innovation Solution
A power plane structure comprising a copper layer with a carbon layer, such as graphite or graphene, applied directly to its surface, enhancing conductivity and reducing power loss. This structure can be duplicated with an insulating core between the copper layers to further improve conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional copper power planes are used, then the structure is simple and manufacturing is easy, but power loss is high due to excessive current density
Solution Approach 1:
The patent applies composite materials by combining carbon layers (graphite or graphene) with copper layers to form a hybrid power plane structure. This composite structure leverages the high electrical conductivity of copper while incorporating the high current density tolerance and thermal stability of carbon materials, thereby reducing power loss without excessive complexity increase
Solution Approach 2:
The patent changes the material parameters of the power plane by introducing carbon-based materials with superior electrical properties. The carbon layers modify the effective conductivity, current density distribution, and thermal characteristics of the power plane, enabling operation at higher current densities with reduced power loss
2Reliability
If carbon layers are added to copper power plane, then conductivity increases and power loss reduces, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary action by pre-fabricating carbon layers (graphite or graphene) separately before integrating them with copper layers. This approach allows for optimized carbon layer production using specialized deposition techniques, followed by integration into the PCB manufacturing process, thereby managing manufacturing complexity while achieving enhanced conductivity
Solution Approach 2:
The patent uses intermediary materials and processes to bridge the integration of carbon and copper layers. Adhesive layers, deposition techniques, and bonding processes serve as intermediaries that facilitate the combination of dissimilar materials (carbon and copper) while maintaining their individual properties and achieving the desired composite structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The incorporation of carbon layers into the copper power plane structure increases conductivity by up to 10% with graphite and up to 60% with graphene, effectively reducing power loss in printed circuit boards compared to conventional power planes.
Implementation Method 1
A power plane structure for a printed circuit board (PCB) comprises a copper layer, and a carbon layer applied directly to a surface of the copper layer. The power plane formed as described herein has increased conductivity in relation to a power plane not including the carbon layer(s).
Data Source
AI summary
A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.