Printed Circuit Aspects TRIZ Cases

A flexible printed substrate folds around a backlight to position LEDs on the rear surface.

A printed circuit board uses sequentially reduced insulating layer thicknesses to enhance bonding strength between substrate portions.

Replacing brominated chemicals with halogen-free epoxides and phosphorated compounds eliminates toxic dioxin generation while preserving flame retardancy.

A wiring circuit board assembly sheet features a dummy structure portion with conductive layers aligned in the thickness direction.

Segmented ceramic lamination enables hermetic seals in thin substrates, solving the trade-off between miniaturization and reliability.

A guide portion pulls a flexible printed circuit board to adjust its height, preventing contact damage from internal chassis components.

A build-up circuit board production method uses patterned metal layers and cured insulating material to form plate structures.

Segmented metal posts distribute stress at fine pitch connection points while reducing material usage.

A flexible layered circuit structure suspends LEDs above a housing substrate to dissipate heat through thermally conductive layers.

A rigid-flex circuit board manufacturing method uses a sacrificial material piece attached to a conductor membrane to define flexible zones within an insulator layer.

Asymmetric conductive pattern areas optimize current distribution to improve shunt resistor detection precision without extra components.

A measurement instrument maps substrate height variations so the processor compensates for ink spread and curing contraction during printing.

A resin composition combining epoxy silicone resin and cyanic acid ester compounds to produce cured products with enhanced flame retardancy.

Metal carrier eliminates silicon wafers and passivation layers to reduce manufacturing complexity while maintaining electrical isolation.

Direct carbon layers on copper power planes increase conductivity by up to 60 percent, reducing power loss at high current densities.

Nested housings enable simultaneous sliding and folding motions, resolving the contradiction between versatile display configurations and mechanical complexity.

Resilient members distribute clamping pressure across solder joints, eliminating localized stress concentrations that cause breakage during rigid assembly.

Remote signal PCB contacts engage spring-loaded connectors to detect module conditions and prevent equipment damage from transient overvoltages.

Thermocompression bonding connects terminals on a folded flexible display panel to simplify the mounting process.

A silicone-based adhesive composition provides strong adhesion and connection reliability when pressure-bonded.

A circuit board structure uses conductive vias and external layers to define a signal path surrounded by a ground path.

Longitudinal recesses in polymer cores mechanically anchor metal coatings, preventing abrasion during fabric bending.

A metal foil with a carrier uses a barrier layer to prevent mutual diffusion and bonding at high temperatures, enabling easy peeling.

Vertical pad columns on the flexible film edge resolve space usability issues while accommodating increased lead counts.

A touch flexible circuit board incorporates an ultraviolet transmitting member to enable light passage through the substrate structure.

A printed wiring board uses sputtered and electroless seed layers in separate build-up parts to form conductor structures.

An integrated printed circuit board merges data and control functions on the main frame side surface.

On-cavity board-to-board interconnects expose solder pads within recessed PCB edges to establish direct electrical coupling between mated boards.

Segmenting the heat dissipation layer into patterned regions optimizes thermal resistance, preventing warpage in high power density modules.

Embedding fine patterns into an insulating layer via a seed layer and press method reduces ion migration risks between adjacent circuits.

Variable density microtubes spread heat flux to prevent immersion cooling fluid dry-out.

Stacked transmission lines form approximated inductor-capacitor networks to correct group delay distortion and optimize signal-to-noise ratio.

A flexible printed circuit board design uses openings in adhesive and cover layers to interpose a second adhesive portion between the cover and reinforcement plate.

A stepped stencil uses alternating plastic and metal layers to enable precise depth control during screen printing.

Interposed conductive inserts shield PCB circuits from corrosion while enabling accurate capacitance-based soil moisture detection.

An upright sub-circuit board with an edge connector replaces bulky terminals, reducing board area and manufacturing costs.

Graded filler layers in a composite resin structure lower thermal expansion and boost adhesion strength for miniaturized printed circuit boards.

Segmented PCB strips housed in a protective cover allow fluid drainage while preventing conductive deposits and short circuits.

A wiring structure with a protruding conductor bridges gaps between heat-generating elements to increase current density and enhance heat generation.

A metal foil with specific protrusion morphology reduces high-frequency signal transmission loss while enhancing peeling strength.

Curved side connection joins folded flexible circuit boards to resolve insufficient insertion strength and thickness mismatch for standard plug structures.

Selective via placement in a wiring board enhances plane layer adhesion without compromising the flatness required for fine signal wirings.

Segmented seed layers in printed wiring board metal posts resolve adhesion reliability issues caused by excessive etching during manufacturing.

A contact hole assembly uses a recess structure to enhance signal transmission efficiency.

Segmented tap terminals with recessed protrusions prevent short circuits between adjacent pins when plating wires break.

A wiring circuit board employs a chromium alloy thin film to lower resistance between the conductive layer and metal supporting board.

Signal integrity vias create an electromagnetic shield around pair anti-pads, reducing crosstalk and enabling 224 Gbps data rates.

Spring terminals connect foldable prongs to PCB pads, eliminating wire harnesses and improving assembly reliability.

Exposed upper and lower metal layers on the PCB connect through a thermally conductive member, transferring heat from the ASIC chip outside the receiving space.