Flexible LED Circuit with Air Gap Heat Dissipation
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Solution Overview
Problem
LED lighting systems face challenges in heat dissipation, particularly in maintaining junction temperature within recommended limits without the need for large heat sinks or secondary heat sinks, which can increase costs and constrain design flexibility.
Innovation Solution
A flexible layered circuit structure with a top thermally conductive layer, a middle electrically insulating layer, and a bottom thermally conductive layer, suspended above a housing substrate with an air gap, allowing for effective heat dissipation through the top and bottom surfaces, thereby maintaining the junction temperature below critical levels without additional heat sinking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large heat sinks or secondary heat sinks are used to dissipate heat from LEDs, then heat dissipation is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines the heat dissipation function with the existing circuit board structure by incorporating thermally conductive layers directly into the PCB. This merges the electrical circuit support function with the thermal management function, eliminating the need for separate large heat sinks while maintaining effective heat dissipation from the LEDs.
Solution Approach 2:
The circuit board is designed to serve multiple functions: providing electrical connections for the LEDs, structural support for mounting, and thermal management through integrated thermally conductive layers. This multi-functionality reduces overall device complexity by eliminating dedicated heat sink components.
2Temperature
If large heat sinks are used to maintain junction temperature, then temperature control is improved, but design flexibility is constrained
Solution Approach 1:
By integrating thermal management directly into the circuit board structure through thermally conductive layers, the design achieves temperature control without the space and structural constraints imposed by traditional large heat sinks. This enables greater design flexibility for various LED configurations and mounting arrangements.
3Temperature
If secondary heat sinks are added to dissipate heat, then heat dissipation is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The thermally conductive layers are integrated into the circuit board manufacturing process itself, allowing heat dissipation functionality to be built in during standard PCB fabrication. This eliminates the need for separate assembly steps to install additional heat sinks, simplifying manufacturing and reducing costs.
4Temperature
If traditional heat sinking methods are used, then heat dissipation is achieved, but the system requires additional components and assembly steps
Solution Approach 1:
The circuit board is designed to simultaneously provide electrical connectivity and thermal management functions through integrated thermally conductive layers. This consolidation eliminates the need for separate heat sink components and their associated mounting hardware, reducing the total number of parts and assembly steps in the LED lighting system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains the junction temperature of LEDs below critical levels, enhancing the longevity and intensity of the LEDs while providing design flexibility and reducing costs by eliminating the need for secondary heat sinks.
Implementation Method 1
dissipating heat from the light emitting diodes to ambient air through the top surface of the top thermally conductive layer and the bottom surface of the bottom thermally conductive layer
Implementation Method 2
dissipating heat from the light emitting diodes to ambient air through the top surface of the top thermally conductive layer and the bottom surface of the bottom thermally conductive layer
Implementation Method 3
an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate
Data Source
AI summary
Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.