Wiring Circuit Board Assembly Sheet Dummy Structure

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Solution Overview

Problem

Wiring circuit boards with metal substrates produced in a roll-to-roll method face damage to terminal and wiring portions due to contact with adjacent metal substrates, leading to connection failures during conveyance and storage.

Innovation Solution

A wiring circuit board assembly sheet design featuring a metal substrate with product and frame regions, where the frame region includes a dummy structure with conductive layers aligned in the thickness direction and taller than the terminal and wiring portions, reducing contact and load on these critical areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the wiring circuit board assembly sheet is produced using a roll-to-roll method with a long metal substrate, then production efficiency is improved, but the terminal portion is easily damaged due to contact with adjacent metal substrate during conveyance and storage

Engineering Contradiction:
Improveproduction efficiencyVSAvoidconnection reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces a dummy structure portion as an intermediary element between the terminal portion and the adjacent metal substrate. This dummy structure includes dummy conductive layers that are taller than the terminal portion, acting as a protective mediator that prevents direct contact between the terminal portion and adjacent substrates during roll conveyance and storage, thereby resolving the contradiction between production efficiency and connection reliability

Inventive Principle:
Principle #24Intermediary (Mediator)

2Ease of operation

If the terminal portion is exposed without insulating layer coverage to enable external connection, then ease of connection is improved, but the terminal portion becomes vulnerable to damage from contact with adjacent metal substrate

Engineering Contradiction:
Improveconnection easeVSAvoidcontact damage
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The dummy structure portion serves as a protective intermediary that shields the exposed terminal portion from harmful contact with adjacent metal substrates. The dummy conductive layers extend higher than the terminal portion, creating a physical barrier that maintains connection accessibility while preventing damage during handling and storage

Inventive Principle:
Principle #24Intermediary (Mediator)

3Volume of moving object

If the assembly sheet is wound into a roll form for conveyance and storage, then space efficiency is improved, but the terminal portion contacts adjacent metal substrate causing damage

Engineering Contradiction:
Improvestorage space efficiencyVSAvoidterminal portion strength
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The dummy structure portion with its taller dummy conductive layers acts as a protective intermediary that prevents direct contact between the terminal portion and adjacent metal substrates during rolled storage and conveyance, maintaining terminal strength while enabling compact roll form storage

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12120829B2Wiring circuit board assembly sheet
Publication Date: 2024.10.15 NITTO DENKO CORP
  • US12120829B2 patent drawing
  • US12120829B2 patent drawing
  • US12120829B2 patent drawing

AI summary

An assembly sheet as a wiring circuit board assembly sheet includes a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate includes a product region and a frame region adjacent thereto. The wiring circuit structure portion is disposed on one surface in a thickness direction of the metal substrate in the product region, and includes a terminal portion. The dummy structure portion is disposed on one surface in the thickness direction of the metal substrate in the frame region, includes a plurality of conductive layers aligned in the thickness direction, and has a greater height above the metal substrate than the terminal portion.