Printed Circuit Board With Asymmetric Insulating Layers
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Solution Overview
Problem
The increasing demand for data processing due to AI technology has led to challenges in reducing defects and improving yield in multi-chip packages, particularly in the substrate structure where various chips are mounted, necessitating enhanced reliability and finer signal paths in printed circuit boards.
Innovation Solution
A printed circuit board design featuring a layered structure with sequentially reduced thicknesses of insulating and circuit layers, along with finer vias and microvias, to improve bonding strength, reduce stress, and enhance signal path precision, thereby addressing defects and yield improvements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional uniform thickness insulating layers are used, then manufacturing is simpler, but bonding strength is insufficient and stress concentration occurs
Solution Approach 1:
The patent applies asymmetry by configuring insulating layers with non-uniform thicknesses, where the first insulating layer has a first thickness, the second insulating layer has a second thickness different from the first, and the third insulating layer has a third thickness different from the second. This asymmetric thickness distribution optimizes bonding strength at interfaces while reducing stress concentration, resolving the contradiction between improved strength and increased structural complexity.
2Manufacturing precision
If conventional thick insulating layers are used, then signal path precision is reduced, but manufacturing is easier
Solution Approach 1:
The patent segments the insulating layer structure into multiple layers with progressively reducing thicknesses. This segmentation allows each layer to be optimized for specific functions: thicker lower layers provide structural support and ease of manufacturing, while thinner upper layers enable precise signal paths and fine pitch circuits, thereby resolving the contradiction between manufacturing precision and ease of manufacture.
Solution Approach 2:
The patent applies local quality by varying the thickness of insulating layers at different positions and levels. The first, second, and third insulating layers have different thicknesses tailored to their specific locations and functional requirements, allowing optimal signal path precision in critical areas while maintaining manufacturing feasibility in other regions.
3Strength
If conventional via structures are used, then manufacturing is simpler, but bonding strength at interfaces is insufficient
Solution Approach 1:
The patent applies asymmetry to via structures by configuring vias with non-uniform dimensions, where the first via has a first width, the second via has a second width different from the first, and the third via has a third width different from the second. This asymmetric via design enhances bonding strength at different interface levels while managing stress distribution, resolving the contradiction between improved bonding strength and increased structural complexity.
Data Source
AI summary
A printed circuit board includes a first substrate portion including a first insulating layer, a second insulating layer disposed on the first insulating layer, and a third insulating layer disposed on the second insulating layer; and a second substrate portion disposed on the first substrate portion and including a first fine insulating layer as a build-up insulating layer on an uppermost side of the first substrate portion and the second substrate portion. A thickness of the first insulating layer, a thickness of the second insulating layer, and a thickness of the third insulating layer are sequentially reduced. A thickness of the first fine insulating layer is lower than the thickness of the third insulating layer.