Epoxy Silicone Resin Composition for Low Thermal Expansion

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Solution Overview

Problem

Current resin compositions used in semiconductor packaging face challenges such as increased brittleness and wear of drill bits due to high inorganic filler content, environmental concerns from bromine-based flame retardants, reduced heat resistance with silicone-based solutions, and compromised drilling processability.

Innovation Solution

A resin composition combining epoxy silicone resin, cyanic acid ester compounds, phenol resin, and inorganic fillers, or BT resin with inorganic fillers, to achieve high flame retardancy, heat resistance, and reduced thermal expansion while maintaining drilling processability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the amount of inorganic filler is increased to reduce the coefficient of thermal expansion, then the coefficient of thermal expansion is reduced, but the resin composition becomes hard and fragile, causing rapid wear of drill bits

Engineering Contradiction:

Improvecoefficient of thermal expansionVSAvoidbrittleness

Core Design Contradiction:

Stability of the object's compositionVSStrength

Solution Approach 1:

The patent changes the chemical composition parameters of the resin system by incorporating epoxy silicone resin and cyanic acid ester compounds in specific ratios, which modifies the cured product's properties to reduce brittleness while maintaining low thermal expansion coefficient

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite resin system combining epoxy silicone resin, cyanic acid ester compounds, phenol resin, and inorganic fillers, where the synergistic interaction between components achieves both low thermal expansion and improved drilling processability

Inventive Principle:

Principle #40Composite materials

2Reliability

If epoxy silicone resin and cyanic acid ester compounds are used to maintain heat resistance and flame retardancy, then flame retardancy and heat resistance are improved, but the resin composition becomes hard and fragile

Engineering Contradiction:

Improveflame retardancyVSAvoiddrilling processability

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent optimizes the ratio parameters of epoxy silicone resin (5-50 parts) and cyanic acid ester compounds (30-70 parts) to achieve the right balance between flame retardancy and drilling processability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces phenol resin as an intermediary component that mediates between the rigid flame-retardant components and the inorganic fillers, improving the overall toughness and drilling processability of the cured product

Inventive Principle:

Principle #24Intermediary (Mediator)

3Stability of the object's composition

If silicone rubber or silicone resin is used to reduce the coefficient of thermal expansion, then the coefficient of thermal expansion is reduced, but heat resistance is reduced

Engineering Contradiction:

Improvecoefficient of thermal expansionVSAvoidheat resistance

Core Design Contradiction:

Stability of the object's compositionVSTemperature

Solution Approach 1:

The patent creates a composite system where epoxy silicone resin provides low thermal expansion while cyanic acid ester compounds and phenol resin contribute high heat resistance, achieving both properties simultaneously

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent merges the advantages of different resin systems by combining epoxy silicone resin (low thermal expansion) with cyanic acid ester compounds and phenol resin (high heat resistance) in a unified cured product

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed resin composition results in cured products with enhanced flame retardancy, heat resistance, and drilling processability, along with a reduced coefficient of thermal expansion, addressing the limitations of existing solutions.

Implementation Method 1

a resin composition, comprising at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group

Methodology Applied

Scientific EffectThermal contraction: Thermal Contraction

Implementation Method 2

adding an inorganic filler to a resin composition

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentEP2910587B1Resin composition, prepreg, laminate plate, metallic foil clad laminate, and printed circuit board

Publication Date: 2019.07.17 MITSUBISHI GAS CHEM CO INC

AI summary

An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).