Patterned Heat Dissipation Layer for Ceramic Substrate Warpage
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Solution Overview
Problem
The development of power modules with high power density is restricted by heat dissipation problems, which also hinders miniaturization and efficiency, particularly in automotive applications where ceramic substrates are used for their thermal conductivity and insulation properties.
Innovation Solution
A ceramic substrate structure with a single ceramic board featuring two conductive layers of different thicknesses, where a heat dissipation layer with patterned regions is mounted on the opposite surface, enhancing heat transfer and preventing warpage due to thermal stress, and integrating a power semiconductor device and gate driver on the same surface for compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high power density is pursued through miniaturization, then power output per unit volume increases, but heat dissipation becomes more difficult
Solution Approach 1:
The heat dissipation layer is segmented into patterned regions with different thicknesses, creating multiple heat dissipation paths with varying thermal resistance. This segmentation allows optimized heat flow distribution across the substrate, enabling effective heat dissipation in compact high-power-density designs
Solution Approach 2:
Different regions of the heat dissipation layer are designed with locally optimized properties - thicker regions provide enhanced heat dissipation capacity where needed, while thinner regions maintain structural integrity and electrical insulation. This local quality variation enables effective thermal management in miniaturized power modules
2Temperature
If heat dissipation efficiency is improved through additional heat dissipation structures, then thermal management improves, but device complexity increases
Solution Approach 1:
The heat dissipation layer serves multiple functions simultaneously: it provides thermal management through patterned heat dissipation regions, maintains electrical insulation between conductive layers, and offers mechanical support for mounted devices. This multi-functionality reduces the need for separate dedicated structures, thereby limiting complexity increase
3Volume of moving object
If multiple devices are mounted on the same ceramic board to reduce size, then power module compactness improves, but thermal stress and warpage increase
Solution Approach 1:
The heat dissipation layer features locally varied thickness patterns that strategically distribute thermal stress across the ceramic board. Thicker regions are positioned to counteract thermal expansion in high-heat areas, while thinner regions maintain flexibility and reduce overall stress accumulation, preventing warpage in compact multi-device configurations
Solution Approach 2:
The patterned heat dissipation layer is designed to accommodate and compensate for thermal expansion differences between various materials in the power module. The varying thickness creates a compliant structure that absorbs thermal stress, maintaining dimensional stability and preventing warpage when multiple devices are mounted on the same ceramic board
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency, prevents warpage, and enables a more compact and efficient power module design suitable for high power density applications.
Implementation Method 1
A ceramic substrate structure with a single ceramic board featuring two conductive layers of different thicknesses, where a heat dissipation layer with patterned regions is mounted on the opposite surface, enhancing heat transfer
Data Source
AI summary
A ceramic substrate structure includes a ceramic board, a first conductive layer, a second conductive layer and a heat dissipation layer. The ceramic board has a first surface and a second surface opposite to each other. Each of the first surface and the second surface is a single surface extending continuously. The first conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is mounted on the first surface of the ceramic board. The second conductive layer is adjacent to the first conductive layer and have different thicknesses. The heat dissipation layer is mounted on the second surface of the ceramic board. The heat dissipation layer includes a first heat dissipation portion corresponding to the first conductive layer and a second heat dissipation portion corresponding to the second conductive layer, and the second heat dissipation portion has a patterned region.