Semiconductor Adhesive Composition for Reliable Chip Mounting
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Solution Overview
Problem
The capillary underfill method for semiconductor chip mounting is complex and inefficient, with poor insulation reliability under high-temperature and humidity conditions, and existing adhesive compositions fail to provide adequate adhesion and connection reliability.
Innovation Solution
A semiconductor adhesive composition comprising a silicone resin, a thermosetting resin, and a compound with flux activity, which functions as both a flux and resin sealant, eliminating the need for capillary underfill steps and enhancing adhesion and insulation reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the capillary underfill method is used for resin sealing, then the gap between semiconductor chip and substrate is sealed, but the process becomes complicated and productivity decreases
Solution Approach 1:
The patent combines the flux function and resin sealant function into a single integrated material. The adhesive composition contains both flux components (for removing oxide films and enabling soldering) and resin sealant components (for gap filling and sealing), eliminating the need for separate flux application and resin sealing steps required in the capillary underfill method.
Solution Approach 2:
The adhesive composition serves multiple functions simultaneously: it acts as a flux during soldering, provides adhesion between chip and substrate, and functions as a resin sealant to fill and seal the gap. This multi-functionality replaces the multiple specialized materials and steps in the conventional process.
2Strength
If acrylic resin containing acrylic nitrile is used as adhesive, then adhesion properties are improved, but insulation reliability under high-temperature and humidity conditions deteriorates
Solution Approach 1:
The patent uses a composite adhesive composition that integrates multiple material systems: epoxy resin (for strong adhesion and insulation), acrylic resin (for adhesion enhancement), and silicone resin (for flexibility and environmental resistance). This composite formulation achieves both high adhesion strength and excellent insulation reliability under high-temperature and humidity conditions, overcoming the limitations of single-component acrylic resins.
3Reliability
If multiple process steps are used for flux application, mounting, joining, cleaning, and resin sealing, then connection reliability is improved, but the number of steps increases and productivity decreases
Solution Approach 1:
The patent merges multiple process steps into a simplified sequence by using an adhesive composition that combines flux and resin sealant functions. The integrated material eliminates the need for separate flux application, flux cleaning, and resin sealing steps, reducing process complexity while maintaining connection reliability through the multi-functional adhesive system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition provides excellent adhesion and connection reliability when pressure-bonded and hardened, improving productivity and insulation performance, ensuring strong bonding and reliable connections in semiconductor applications.
Implementation Method 1
utilizing a capillary phenomenon to flow the resin composition into the gap between the circuit substrate and the chip
Data Source
Figure 1(I)~1(II)
Figure 2
Figure 3
AI summary
An object is to provide a semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and to provide an adhesive sheet using this adhesive composition. There is provided an adhesive composition comprising: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of 1 and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0<(c+d)/(a+b+c+d)≤1.0; and each of X and Y is a bivalent organic group.