Rigid-Flex Circuit Board Manufacturing Using Sacrificial Material
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Solution Overview
Problem
Current manufacturing methods for rigid-flex-type circuit boards face challenges in achieving high packaging density and efficient production of complex electronic modules with high-quality electrical contacts, particularly in multi-layer packages.
Innovation Solution
A new manufacturing method involving a flexible membrane and sacrificial material attached to a conductor membrane, with an insulator layer enclosing the sacrificial material, allows for the creation of flexible zones and conductors, enabling the production of rigid-flex-type electronic modules with unified metal contact elements and reduced need for through-hole connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional manufacturing methods are used for rigid-flex circuit boards, then production is simpler, but packaging density is lower and manufacturing process is longer
Solution Approach 1:
The sacrificial material is attached to the conductor membrane before forming the insulator layer, allowing the flexible zone to be created in advance. This preliminary action enables subsequent folding and assembly operations to be performed more efficiently, increasing packaging density without proportionally increasing overall process complexity
Solution Approach 2:
The sacrificial material acts as an intermediary element that is temporarily introduced into the structure, then removed after serving its purpose of defining the flexible zone. This intermediary approach allows complex folded structures to be manufactured through a controlled process sequence
2Manufacturing precision
If through-hole connections are used for contacts, then electrical connections are established, but packaging density is reduced and surface area increases
Solution Approach 1:
The invention transitions from planar through-hole connections to three-dimensional folded structures where conductors run over flexible zones. This dimensional change allows multiple connection layers to be stacked vertically, increasing connection density without proportionally increasing the XY footprint of the package
Solution Approach 2:
The folded structure creates nested layers where conductors and components are arranged in multiple levels. This nesting approach allows higher connection density by utilizing vertical space within the package, reducing the required surface area while maintaining or increasing the number of connections
3Manufacturing precision
If complex electronic modules with high connection density are manufactured, then functionality is improved, but manufacturing time and process complexity increase
Solution Approach 1:
The method combines multiple manufacturing operations into integrated process steps. The flexible zone formation, conductor patterning, and insulator layer creation are performed in a coordinated sequence that reduces the total number of separate manufacturing stages, thereby improving productivity while achieving high connection density
Solution Approach 2:
By preparing the flexible zone and conductor structure in advance through the sacrificial material method, subsequent assembly and connection operations can be performed more rapidly. This preliminary structuring enables faster manufacturing of complex modules without sacrificing connection density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of high-quality, cost-effective rigid-flex type electronics modules with increased packaging density and a shorter manufacturing process for multi-layer packages, allowing for more conductors in a given area and embedding components with higher connection density.
Implementation Method 1
the contact elements are unified metal pieces, consisting of one or more metal layers, each of which is manufactured by growing using a chemical or electrochemical method
Implementation Method 2
the contact elements are unified metal pieces, consisting of one or more metal layers, each of which is manufactured by growing using a chemical or electrochemical method
Data Source
AI summary
Rigid-flex-type circuit-board structure and manufacturing method, in which a flexible membrane and a sacrificial-material piece are attached to an insulator membrane in the location of the flexible zone. An insulator layer, which encloses within itself a sacrificial-material piece is manufactured on the surface of the conductor membrane. The flexible zone is formed in such a way that an opening is made in the insulator layer, through which the sacrificial-material piece is removed. The flexible zone comprises at least part of the flexible membrane as well as conductors, which are manufactured by patterning the insulator membrane at a suitable stage in the method.