Stacked Flexible PCB With Curved Side Connection

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Solution Overview

Problem

Flexible circuit boards face challenges in providing sufficient insertion and connection strength due to their flexibility, making them unsuitable for compact and lightweight electronic products, and their thickness does not match common plug structures, limiting their application.

Innovation Solution

A stacked flexible printed circuit board assembly is created by connecting the side edges of two flexible printed circuit boards with a curved connection section, where one board is folded over the other, and a height adjustment layer or adhesive layer is used to align and secure the contact pads, forming a robust connection structure suitable for plugging members like C-Type USB connectors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If a flexible circuit board is used as a connection structure, then flexibility and lightweight properties are achieved, but insertion and connection strength are insufficient

Engineering Contradiction:
ImproveweightVSAvoidconnection strength
Core Design Contradiction:
Weight of moving objectVSStrength

Solution Approach 1:

The patent combines multiple flexible circuit boards into a stacked assembly where multiple layers are connected through curved connection sections. This merging of multiple flexible boards creates a structure with enhanced connection strength while preserving the flexibility and lightweight characteristics of individual flexible boards.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a single-plane flexible circuit board to a three-dimensional stacked structure by folding boards at curved connection sections. This dimensional change from 2D to 3D stacking provides mechanical interlocking and increased connection strength while maintaining overall flexibility.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Stability of the object's composition

If a rigid circuit board is used as a substrate, then structural stability is achieved, but flexibility and lightweight properties are lost

Engineering Contradiction:
Improvestructural stabilityVSAvoidweight
Core Design Contradiction:
Stability of the object's compositionVSWeight of moving object

Solution Approach 1:

The patent uses flexible circuit boards with curved connection sections that act as flexible hinges, providing structural stability through the stacked configuration rather than rigid materials. The curved connection sections maintain stable geometric relationships between layers while allowing flexibility.

Inventive Principle:
Principle #30Flexible shells and thin films

3Device complexity

If a single flexible circuit board is used, then simplicity is maintained, but thickness does not match common plug structures

Engineering Contradiction:
Improvestructure complexityVSAvoidthickness
Core Design Contradiction:
Device complexityVSLength of stationary object

Solution Approach 1:

The patent divides the circuit board into multiple separate flexible boards stacked together, with each board contributing to the overall thickness. This segmentation allows precise control of total thickness to match plug structures while keeping individual boards simple and manageable.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements a nested stacking configuration where multiple flexible circuit boards are folded and connected in a compact arrangement. This nesting approach achieves the required thickness for plug compatibility while maintaining a space-efficient structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS10219379B1Stacked flexible printed circuit board assembly with side connection section
Publication Date: 2019.02.26 ADVANCED FLEXIBLE CIRCUITS
  • US10219379B1 patent drawing
  • US10219379B1 patent drawing
  • US10219379B1 patent drawing

AI summary

A stacked flexible printed circuit board assembly with a side connection section is provided, including a first flexible printed circuit board, a second flexible printed circuit board, and a curved connection section. The curved connection section is integrally connected to and between side edges of the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board is folded in a direction toward and thus stacked on the second flexible printed circuit board such that a plurality of first contact pads of the first flexible printed circuit board correspond respectively to a plurality of second contact pads of the second flexible printed circuit board. A height adjustment layer or an adhesive layer is provided between the first flexible printed circuit board and the second flexible printed circuit board to suit the need of thickness in plugging or soldering.