Carbon Insert Heat Spreader for Power Electronics Thermal Management
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Solution Overview
Problem
Conventional aluminum heat sinks struggle to efficiently manage high heat loss densities in power electronics modules, leading to increased temperatures and reduced cooling effectiveness, especially at maximum power levels, due to high thermal resistance and increased costs associated with more advanced cooling solutions.
Innovation Solution
A heat transfer structure incorporating a metallic body with a carbon-based insert, such as graphite or graphene plates, providing anisotropic thermal conductivity to enhance heat transfer efficiency within the power electronics module, allowing for effective heat spreading and reduced hotspot formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional aluminum heat sinks are used, then manufacturing cost is low and ease of manufacture is good, but thermal conductivity and heat transfer efficiency deteriorate at high heat loss densities
Solution Approach 1:
The patent applies composite materials by combining aluminum heat sink base plate with copper heat spreading plates and thermal interface materials to create a multi-material heat transfer structure. This composite approach enables the system to achieve high thermal conductivity where needed (at heat spots) while maintaining manufacturing feasibility through modular assembly of different material components with complementary thermal properties.
2Loss of energy
If copper heat spreading plates are added to improve heat transfer, then thermal conductivity improves, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies local quality by placing copper heat spreading plates specifically at locations corresponding to heat-generating semiconductor components, rather than using copper throughout the entire heat sink. This localized application of high-conductivity material addresses thermal resistance problems at critical hot spots while avoiding the complexity and cost of completely redesigning the heat sink structure with copper.
3Loss of energy
If advanced cooling solutions are implemented, then heat transfer efficiency improves, but manufacturing cost increases
Solution Approach 1:
The patent applies segmentation by dividing the heat transfer system into distinct functional modules: aluminum heat sink base plate, copper heat spreading plates, thermal interface materials, and semiconductor components. This modular segmentation allows each component to be optimized independently for its specific function and manufactured using appropriate processes, then assembled into an integrated cooling system that achieves advanced cooling performance without prohibitive manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The carbon-based insert enhances thermal characteristics, enabling efficient heat transfer and utilization of power semiconductor switches, while maintaining a low-cost solution by reducing the need for complex and costly cooling arrangements.
Implementation Method 1
The base plate is a heat transfer structure comprising a metallic body having a first surface and a second surface, and a carbon based insert. The carbon based insert enhances thermal characteristics, enabling efficient heat transfer
Implementation Method 2
providing anisotropic thermal conductivity to enhance heat transfer efficiency within the power electronics module, allowing for effective heat spreading and reduced hotspot formation
Data Source
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AI summary
A heat transfer structure, wherein the structure comprises a metallic body having a first surface and a second surface. The first surface and the second surface are opposing surfaces, one of the first surface and the second surface is adapted to receive a heat generating component, and the metallic body comprises a carbon based insert.