Cooling/Ventilation/Heating Modifications TRIZ Cases

A hybrid cooling device merges spray and immersion techniques to manage thermal energy in electronic modules.

An error detection system estimates cooling apparatus performance using temperature and current sensors.

An air-conditioning control apparatus calculates inlet temperature variations and unit sensitivity to manage airflow.

A diversion system manages cooling medium circulation using a single pumping apparatus and multiple pipelines.

Segmented cooling racks isolate thermal zones to eliminate inefficient air mixing in data centers.

A channel diversion device redirects airflow to merge thermal currents from electronic components and controllers.

A dual fluid delivery system uses a manifold and flexible hoses to supply cooled liquid directly to device cooling plates within an immersion tank.

Segmented graphite heat dissipation parts in a movable casing prevent temperature rises during interpupillary adjustment.

A metallic heat transfer structure incorporates a carbon-based insert to conduct thermal energy across the base plate.

An actuator moves a variable volume body to displace coolant, resolving pressure and heat removal trade-offs in aerospace electronics.

A hybrid thermal test vehicle integrates air-cooled heat elements with liquid-cooled traces to enable concurrent testing of datacenter cooling subsystems.

A sliding plate with guide slits moves a cold plate to maintain thermal contact.

Heat pipes extract thermal energy from immersed servers into circulating oil, enabling domestic hot water generation without component overheating.

Integrated heat pipes extract heat from densely packed converters, resolving thermal transfer bottlenecks in high-density arrangements.

Segmented airflow assemblies balance cooling across orthogonal circuit boards, resolving heat dissipation limits in space-constrained data centers.

Angled adjacent axial fans reduce noise by 4-5 dB while maintaining cooling effectiveness in compact power electronic apparatuses.

Hot-swappable power modules and segmented coolant manifolds enable repairable cooling without condensation risk across 15 kW to 500 kW scales.

A liquid-cooling module uses detachable heat dissipating assemblies connected to flow tubes.

A power card aligns switches vertically to enable uniform heat exchange with lateral refrigerant flow.

Segmented liquid immersion and air-cooling tanks preserve general hard disk read/write capability while managing high device density.

Adjustable vent covers redirect hot exhaust air away from cold aisles, reducing recirculation and stabilizing rack inlet temperatures.

Parallel heat pumps switch modes via three-way valves to recover waste heat from processors, ensuring continuous building heating during low-load periods.

A ventilation channel directs airflow through a heat collection cavity to cool LED modules.

Quick connectors with data readers and breaker boxes route liquid coolant to servers, resolving inflexible plumbing limitations.

Bypass fluid paths maintain continuous cooling during hot-swappable cold plate replacement, eliminating system downtime.

Segmenting large openings into multiple small orifices distributes structural stress and reduces turbulence while maintaining airflow rates.

Dynamic flow branching eliminates rack-wide overcooling by enabling specific heat exchangers based on real-time power consumption.

A modular data center system directs ambient air through rack plenums to remove heat without active cooling components.

Segmented hermetic enclosures isolate fire risks while maintaining autonomous cooling for electronic systems.

A server cooling system uses temperature sensors to adjust fan speeds and maintain directed airflow.

External cooling unit above IT rooms circulates fluid using gravity and natural convection to remove heat from electronic racks.

Non-uniform liquid flow channels and throttling zones in a liquid cooled cold plate manage heat flux from high powered microelectronics.

Telescoping vertical exhaust duct sections adjust length to match server cabinet heights, resolving plenum height mismatch.

A processor-controlled image forming apparatus restricts printing operations during active dew condensation elimination to prevent moisture damage.

Integrated housing wall coolant channel absorbs heat from electrical conductors, reducing temperature without increasing module weight or volume.

A base plate with fins and an axial tube defines a sequential flow pathway through a slot for liquid coolant immersion.

A two-phase flow active and passive multi-level data center cabinet cooling device manages heat transfer through a closed-loop thermosiphon system.

Segmented stationary and mobile cooling plates allow quick electronic module replacement while maintaining thermal contact integrity.

A heat dissipation mechanism rotates blades via buoyancy and weight to adjust ventilation, preventing rainwater ingress while maintaining cooling.

The system switches between recirculation and pure outside air modes to handle high heat loads from generating devices while maintaining heat exchanger efficiency.

A fully redundant phase change cooling unit uses parallel condenser loops and pressure sensors to distribute fluid flow dynamically.

A heat sink assembly uses two serpentine cooling circuits to deliver opposing coolant flows through a main body for uniform thermal distribution.

Segmented modular units with variable speed fans resolve slow cooling response times in high-density datacenters.

Segmented coolant channels and intermediary thermal plates transfer heat from high-flux components to the cooling structure without breaking fluid connections.

Copper foil covers electronic devices while a graphite film on the opposite surface conducts heat away, reducing thermal stress.

A reconfigurable air management system uses detachable perforated plates to control airflow direction and volume within electronic equipment cabinets.

Extending a porous metal heat-dissipation layer to the side surface improves thermal conduction without increasing display thickness.

A dual heat sink system conducts internal module heat to external fins and fans for rapid dissipation.

Configurable airflow exhaust panels enable heated air to exit through either the top or rear of an equipment cabinet.

A movable heat radiating member uses an elastic thermal bonding material to transfer heat from electronic devices.