Display Module Copper Foil Graphite Film Heat Dissipation
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Solution Overview
Problem
The thermal stability and reliability of display apparatuses are compromised due to increased heat flux on circuit boards as a result of growing power requirements in large-sized display systems, leading to component damage and reduced lifespan.
Innovation Solution
A display module comprising a display panel, a circuit board, an electronic device, a copper foil, and a graphite film, where the copper foil covers the electronic device and the graphite film is disposed on the circuit board's second surface, enhancing heat dissipation through a network of bonding layers and strategic openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power of electronic components is increased to meet large-sized display requirements, then the display performance is improved, but the heat flux on the circuit board increases sharply
Solution Approach 1:
The patent introduces a heat dissipation film as an intermediary layer between the circuit board and the display panel. This film contains heat dissipation particles that act as mediators to transfer heat from the circuit board components to the display panel, which then dissipates the heat to the external environment. This resolves the contradiction by providing a thermal pathway that allows high-power components to operate without causing excessive heat accumulation on the circuit board.
2Loss of energy
If traditional heat dissipation methods are used, then some heat can be removed, but the thermal stability and reliability remain poor due to sharp heat flux increase
Solution Approach 1:
The heat dissipation film is constructed as a composite material containing heat dissipation particles dispersed in a binder material. This composite structure combines the thermal conductivity benefits of the particles with the structural integrity and adhesion properties of the binder, creating a material that effectively transfers heat while maintaining mechanical strength and reliability under thermal stress.
3Temperature
If heat dissipation structures are added to the circuit board, then heat flux is reduced, but the device complexity increases
Solution Approach 1:
The display panel serves multiple functions: it displays images and simultaneously acts as a heat dissipation pathway for the circuit board. By utilizing the existing display panel structure for dual purposes (display and thermal management), the patent avoids adding separate complex heat dissipation structures to the circuit board, thereby reducing overall device complexity while still achieving effective heat flux reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat dissipation from the circuit board and electronic devices, reducing surface temperatures and prolonging the lifespan of display components while maintaining a lightweight design.
Implementation Method 1
The graphite film is disposed on the second surface of the circuit board... effectively improves heat dissipation from the circuit board and electronic devices
Implementation Method 2
The copper foil covers the electronic device... effectively improves heat dissipation from the circuit board and electronic devices
Data Source
AI summary
A display module and a display apparatus. The display module includes a display panel, a circuit board, an electronic device, a copper foil and a graphite film. The circuit board is electrically connected to the display panel. The circuit board includes a first surface and a second surface that are opposite to each other. The electronic device is disposed on the first surface of the circuit board. The copper foil covers the electronic device. The graphite film is disposed on the second surface of the circuit board.