LED Display Door Leaf Heat Dissipation Structure
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Solution Overview
Problem
Large LED display screens face issues with centralized heat dissipation when multiple small modules are assembled, leading to product failure and premature aging due to inadequate heat management.
Innovation Solution
A heat dissipation structure for the door leaf of an LED display box is designed with a box frame and door leaf, featuring a heat collection cavity, ventilation and heat dissipation channel, and air inlet and outlet, which directs airflow to transfer heat from the LED modules to a heat collection cavity and lining board for effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple small LED module panels are assembled together to expand display size, then the display range and display size are improved, but centralized heat dissipation becomes inadequate leading to product failure and premature aging
Solution Approach 1:
The door leaf is divided into multiple functional layers including outer door leaf plate, insulation layer, heat dissipation channel layer, and heat source part. This segmentation allows each layer to perform its specific function: the outer plate provides structural support, the insulation layer prevents heat transfer to the exterior, the heat dissipation channels conduct heat away from LED modules, and the heat source part captures and directs heat flow, collectively solving the heat dissipation problem in large-scale displays
Solution Approach 2:
The heat dissipation channels act as intermediary pathways between the LED modules (heat sources) and the external environment. These channels provide dedicated thermal conduction paths that intercept heat before it can accumulate in the display structure, effectively mediating the heat transfer process and preventing overheating in large assembled displays
2Device complexity
If traditional heat dissipation methods are used in large LED displays, then the structure remains simple, but heat dissipation effectiveness is insufficient causing product failure
Solution Approach 1:
The heat dissipation structure employs a nested configuration where the heat source part is positioned within the door leaf structure, surrounded by heat dissipation channels that are in turn surrounded by insulation layers. This nested arrangement maximizes heat capture efficiency while maintaining a compact integrated structure that does not significantly increase overall device complexity
Solution Approach 2:
The invention transitions from traditional planar heat dissipation to a three-dimensional heat management system by incorporating vertical heat dissipation channels and layered structures within the door leaf. This dimensional approach creates multiple heat conduction pathways in different directions, significantly improving heat dissipation effectiveness without proportionally increasing structural complexity
3Temperature
If the door leaf is designed for ventilation and heat dissipation, then heat management is improved, but waterproofing capability may be compromised
Solution Approach 1:
The insulation layer serves as a flexible barrier that provides both thermal insulation and waterproof protection. This layer acts as a continuous protective film that prevents moisture penetration while allowing the heat dissipation channels to function, effectively decoupling the ventilation and waterproofing functions
Solution Approach 2:
The waterproofing function is extracted and isolated to specific components (insulation layer and sealing structures) rather than being integrated throughout the entire door leaf. This allows the heat dissipation channels to operate freely in non-critical areas while waterproofing is concentrated at critical interfaces and boundaries
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure effectively manages heat generated by LED modules, preventing overheating and extending the lifespan of the display screen by ensuring efficient ventilation and heat dissipation, even when the door is closed, while maintaining waterproofing.
Implementation Method 1
a ventilation and heat dissipation channel (400) is formed between the inner lining board (220) and the outer door leaf plate (210), wherein the ventilation and heat dissipation channel (400) is in communication with the heat collection cavity (300)... the air in the ventilation and heat dissipation channel (400) flows in from the air inlet (410), and then flows out from the air outlet (420)
Implementation Method 2
the heat generated by the operation of the LED display modules is concentrated in the heat collection cavity (300)... part of the heat generated by the operation of the heat source part (500) of the box is directly transferred to the heat collection cavity (300)
Data Source
Figure 1
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Figure 3
AI summary
A heat dissipation structure of the door leaf of an LED display box, comprising a box frame (100) and a box door leaf (200), a heat collection cavity (300) is simultaneously formed in the box frame (100) and on the backs of the LED display modules, when working, a number of the LED display modules are energized and emitting light, and the light is irradiated forward, and the heat generated by the operation of the LED display modules is concentrated in the heat collection cavity (300),the box door leaf (200) comprises an outer door leaf plate (210) and an inner lining board (220), wherein the inner lining board (220) is arranged on the inner side (211) of the outer door leaf plate (210), and at the same time, a ventilation and heat dissipation channel (400) is formed between the inner lining board (220) and the outer door leaf plate (210),the ventilation and heat dissipation channel (400) is in communication with the heat collection cavity (300),the ventilation and heat dissipation channel (400) comprises an air inlet (410) and an air outlet (420), wherein the air inlet (410) is in communication with the heat collection cavity (300), and the air outlet (420) is arranged on the outer door leaf plate (210),the box heat source part (500) is fixedly connected to the inner side (221) of the lining board, and at the same time, the box heat source part (500) is located in the heat collection cavity (300).