Stationary Mobile Cooling Plate Module Replacement
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Solution Overview
Problem
Liquid cooled electronic modules are difficult to replace without disturbing the hydraulic cooling connections, which complicates the quick removal and replacement process, thereby increasing downtime in electronic devices.
Innovation Solution
A compartmentalized liquid cooled electronic device design featuring a stationary cooling plate integrated into the enclosure and a mobile cooling plate on the electronic module, allowing for heat transfer without disconnecting hydraulic connections, facilitated by grooves, ridges, and thermally conductive coatings for efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If liquid cooled electronic modules use plug-in connectors for electrical connections, then electrical connection speed is improved, but hydraulic cooling connection complexity increases making replacement more difficult
Solution Approach 1:
The cooling system is segmented into a stationary cooling plate attached to the enclosure and a mobile cooling plate attached to the electronic module. This segmentation allows the module to be replaced independently without disturbing the main hydraulic cooling connections, as only the mobile cooling plate needs to be detached and reattached during module replacement.
Solution Approach 2:
The mobile cooling plate is extracted as a separate component that can be independently attached to and detached from the electronic module. This extracted component serves as an interface between the module and the stationary cooling system, enabling quick module replacement while maintaining the integrity of the main hydraulic cooling connections.
2Loss of time
If electronic modules are quickly removable for maintenance, then downtime is reduced, but thermal contact between cooling system and module may be compromised
Solution Approach 1:
The mobile cooling plate is pre-equipped with thermal interface surfaces and cooling channels that are designed to automatically align and make intimate thermal contact with the stationary cooling plate when the module is inserted. This preliminary preparation ensures that thermal contact is established as part of the module installation process itself, without requiring additional adjustment steps that would increase downtime.
Solution Approach 2:
The mobile cooling plate acts as an intermediary component that ensures reliable thermal contact between the electronic module and the stationary cooling plate. It includes thermal interface surfaces and cooling channels that mediate the heat transfer process, guaranteeing consistent thermal contact reliability while allowing the module to be easily removed and replaced.
3Temperature
If hydraulic cooling connections are integrated into the electronic module, then cooling efficiency is improved, but module replacement complexity increases
Solution Approach 1:
The hydraulic cooling system is segmented into stationary and mobile portions. The stationary cooling plate with main hydraulic connections remains fixed in the enclosure, while only the mobile cooling plate attached to the module needs to be detached during replacement. This segmentation maintains efficient thermal coupling during operation while greatly simplifying the module replacement process.
Solution Approach 2:
The mobile cooling plate is extracted as a separable component that contains the cooling channels and thermal interface. This extracted component can be easily detached from the module and reattached to a replacement module, maintaining cooling efficiency while enabling simple module replacement without disturbing the main hydraulic cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and efficient replacement of electronic modules without disrupting the hydraulic cooling system, reducing downtime and maintaining continuous operation by separating the cooling mechanism into stationary and mobile plates for seamless heat transfer.
Implementation Method 1
The heat generated by the electronic module is removed by flowing into the mobile cooling plate, then into the stationary cooling plate, and then into the cooling liquid
Implementation Method 2
the stationary cooling plate comprising a liquid cooling system configured to remove heat from the stationary cooling plate
Data Source
AI summary
Embodiments include a liquid cooled electronic device including a compartment configured to enclose an electronic module therein. The compartment includes a stationary cooling plate disposed on an interior portion of the compartment, the stationary cooling plate comprising a liquid cooling system configured to remove heat from the stationary cooling plate and a plurality of electrical connectors configured to connect to the electronic module. The electronic module includes a mobile cooling plate configured to intimately fit with the stationary cooling plate when the plurality of electrical connectors are connected to the electronic device module. The heat generated by the electronic module is removed by the mobile cooling plate and the stationary cooling plate.