Power Semiconductor Module Housing Wall Coolant Channel
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Solution Overview
Problem
Power semiconductor modules experience undesirable heating of electrical conductors due to ohmic resistance, leading to losses and potential long-term stability issues, and increasing the cross-sectional area of these conductors to mitigate heating results in higher material and space costs.
Innovation Solution
Incorporating a coolant channel within the housing wall that surrounds or is adjacent to the electrical conductor, allowing liquid coolant to absorb heat effectively, thereby reducing conductor temperature without increasing module size or material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cross-sectional area of the electrical conductor is increased to reduce ohmic resistance and heating, then the conductor temperature is reduced, but the material costs and weight of the power semiconductor module increase
Solution Approach 1:
The housing wall is segmented to include integrated coolant channels within its structure. This allows the cooling function to be distributed throughout the housing wall rather than requiring a separate cooling system, enabling effective heat removal from conductors without increasing conductor cross-sectional area or module weight.
Solution Approach 2:
A coolant channel filled with liquid coolant acts as an intermediary heat transfer medium between the electrical conductor and the external environment. The coolant absorbs heat from the conductor through thermal conduction and carries it away, effectively reducing conductor temperature without requiring larger conductor cross-sections.
2Temperature
If the cross-sectional area of the electrical conductor is increased to reduce ohmic resistance and heating, then the conductor temperature is reduced, but the space required for the power semiconductor module increases
Solution Approach 1:
The coolant channel is nested within the housing wall structure itself, utilizing the existing space of the module housing. This nested arrangement allows cooling functionality to be integrated into the housing wall without adding external dimensions or increasing the overall module volume.
Solution Approach 2:
The cooling function is transferred from the conductor cross-sectional dimension to the housing wall thickness dimension. By creating coolant channels within the housing wall, the patent utilizes the third dimension (depth/thickness of housing wall) to provide cooling, thereby avoiding the need to increase conductor cross-sectional area and resulting module volume.
3Temperature
If coolant channels are added to cool electrical conductors, then conductor heating is reduced, but the device complexity increases
Solution Approach 1:
The cooling function is merged with the housing wall structure. The coolant channels are integrated directly into the housing wall, combining the structural and cooling functions into a single component system. This merging approach reduces the number of separate parts and simplifies the overall module structure compared to having distinct cooling components.
Solution Approach 2:
The housing wall serves multiple functions: it provides structural support, electrical insulation, and integrates coolant channels for thermal management. This multi-functionality reduces the need for separate dedicated cooling components, thereby reducing device complexity while achieving effective conductor cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This active cooling method effectively dissipates heat from electrical conductors, reducing their temperature and preventing overheating, while minimizing material usage and module size, allowing for more efficient operation and reduced cooling requirements.
Implementation Method 1
the coolant channel is located adjacent to the electrical conductor. This allows the coolant flowing through the coolant channel to absorb the heat generated in the electrical conductor particularly well
Implementation Method 2
The often high electrical current flowing in power semiconductor modules heats up the electrical conductor(s) due to their ohmic resistance
Data Source
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AI summary
The invention relates to a power semiconductor module (1) comprising at least two power semiconductor units (203, 206), which are interconnected and comprise controllable power semiconductor components (209), and a module housing (2), in which the power semiconductor units (203, 206) are arranged. The module housing (2) has a housing wall (5). An electrical conductor (15) for connecting one of the power semiconductor units (206) extends through the housing wall (5). The housing wall (5) comprises a coolant channel (201) for cooling the electrical conductor (15).