Liquid Cooled Cold Plate with Non-Uniform Flow Channels
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Solution Overview
Problem
Traditional air-based heat sinks are inadequate for cooling high-powered microelectronics with high heat flux devices, especially when multiple devices are in close proximity, as they fail to efficiently manage non-uniform heat flux distributions and add unnecessary weight and cost.
Innovation Solution
A liquid-cooled cold plate design featuring a support base with varying thickness and regions of cooling structures, including fins, posts, and rods, along with non-uniform liquid flow channels and throttling zones, optimized for thermal contact and efficient heat removal using 3D printing and other manufacturing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-based heat sinks with large number and volume of cooling fins are used, then heat dissipation surface area is increased, but cooling efficiency for high heat flux devices is insufficient and weight increases
Solution Approach 1:
The patent replaces air-based heat sinks with liquid-cooled cold plates that utilize liquid flow channels to remove heat from high heat flux devices. The liquid cooling system includes cooling channels formed within the cold plate structure, allowing efficient heat transfer through liquid convection, thereby achieving superior cooling efficiency while reducing the weight and volume compared to traditional air-cooled fins.
2Adaptability or versatility
If traditional air-based heat sinks are used for multiple high heat flux devices in close proximity, then device density is increased, but cooling performance becomes inadequate
Solution Approach 1:
The patent implements non-uniform cooling structures where the cold plate includes varying thickness regions and different cooling channel configurations tailored to match non-uniform heat flux distributions from multiple high heat flux devices. This localized optimization allows efficient cooling of densely packed devices with different thermal requirements without compromising cooling performance.
Solution Approach 2:
The patent transitions from two-dimensional air-cooled fin structures to three-dimensional liquid-cooled cold plate structures with varying thickness and integrated cooling channels. This dimensional transformation enables better thermal management for multiple high heat flux devices in close proximity by utilizing vertical flow channels and varied cooling structure heights to optimize heat removal efficiency.
3Ease of manufacture
If uniform liquid flow channels are used throughout the cold plate, then manufacturing is simplified, but heat removal efficiency for non-uniform heat flux is reduced
Solution Approach 1:
The patent employs non-uniform liquid flow channels with varying cross-sectional areas and lengths positioned at different locations within the cold plate. These variable channel dimensions are strategically designed to deliver higher flow rates to regions with higher heat flux and lower flow rates to regions with lower heat flux, thereby optimizing heat removal efficiency while remaining manufacturable through techniques like 3D printing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The liquid-cooled cold plate effectively manages non-uniform heat flux by precisely controlling liquid flow and pressure, enhancing heat removal efficiency while reducing weight and cost, thus improving the reliability and performance of high heat flux devices.
Implementation Method 1
a first region of cooling structures in thermal contact with the support base for removing heat from a first heat flux region of the electronic apparatus
Implementation Method 2
liquid flow channels for directing a cooling liquid to flow through the first region of cooling structures and the second region of cooling structures
Data Source
AI summary
A liquid cooled cold plate for removing heat from an electronic apparatus. The liquid cooled cold plate includes a support base and one or more regions of high heat flux cooling structures in thermal contact with the support base. Liquid flow channels for directing a cooling liquid to flow through the cooling structures determine the flow rate and pressure of the cooling liquid. The cooling structures may include cooling posts, cooling rods, cooling cones, cooling fins and/or a complex arrangement of interconnected cooling structures such as interconnected cooling rods. These structures may be of uniform size or non-uniform size. One or more of the liquid flow channels may include a liquid throttling zone. This liquid throttling zone can be oriented horizontally or vertically relative to the support base of the liquid cooled cold plate. 3D printing as well as other manufacturing techniques may be used to produce the cold plate.