Modular Liquid-Cooled Power System with Hot-Swap Cooling

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Solution Overview

Problem

Existing liquid cooling systems for electronic systems are difficult to repair, prone to condensation issues, and lack flexibility for expansion or upgrade, particularly in power conversion systems where modular and scalable architectures are desirable.

Innovation Solution

A modular, scalable liquid-cooled power system with hot-plug, hot-swap power conversion modules and a flexible coolant management system, including modular manifolds and a system control and administration system, optionally incorporating a liquid-to-air heat exchanger for efficient heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional plumbed liquid cooling assemblies are used, then cooling effectiveness is achieved, but repair difficulty increases and system flexibility decreases

Engineering Contradiction:

Improvecooling effectivenessVSAvoidrepair difficulty

Core Design Contradiction:

ReliabilityVSEase of repair

Solution Approach 1:

The liquid cooling system is divided into modular assemblies that can be independently removed and replaced. Each module contains integrated cooling components (heat exchangers, pumps, manifolds) that function as self-contained units, allowing failure isolation and simplified repair without affecting the entire cooling system.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The system employs dynamic reconfigurability where modular cooling assemblies can be hot-swapped during operation. This allows maintenance personnel to replace failed modules without shutting down the entire system, maintaining cooling effectiveness while improving repair ease.

Inventive Principle:

Principle #15Dynamics

2Reliability

If customized sub-system cabinets are used, then specific cooling requirements are met, but system expansion flexibility is limited

Engineering Contradiction:

Improvecooling performanceVSAvoidsystem expansion flexibility

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The modular cooling assemblies are designed with universal interfaces and standardized mounting configurations that can adapt to different cabinet sizes and power system configurations. This allows the same cooling module to serve multiple functions across different system scales, from small edge computing devices to large data center installations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cooling system employs a hierarchical modular structure where smaller cooling modules can be nested within larger system configurations. Multiple identical modules can be stacked or arranged in arrays to scale cooling capacity according to system requirements, providing flexibility without requiring custom designs for each configuration.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Temperature

If liquid cooling is implemented, then heat dissipation effectiveness is improved, but condensation risk increases

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidcondensation risk

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The system introduces environmental sensors and control systems as intermediaries between the cooling liquid and the electronic components. These sensors monitor temperature and humidity conditions, while control systems adjust cooling parameters to maintain operation above the dew point, effectively mediating the condensation risk while preserving heat dissipation effectiveness.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Adaptability or versatility

If modular power conversion modules are used, then system scalability is improved, but device complexity increases

Engineering Contradiction:

Improvesystem scalabilityVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The power conversion system is segmented into identical, standardized modules that can be easily replicated and scaled. Each module contains complete power conversion functionality, allowing systems to be built by simply adding or removing modules rather than reconfiguring complex internal connections, thus improving scalability while managing complexity through standardization.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easy maintenance, cost-effective, and flexible power management with reduced risk of condensation, allowing for scalable power delivery from 15 kW to 500 kW in a compact footprint.

Implementation Method 1

heat from electronic components can be transferred directly to liquid coolant via conduction

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

heat that is dissipated into the local system environment via convection can be transferred to a localized air-to-liquid heat exchanger

Methodology Applied

Scientific EffectHeat convection: Convection

Data Source

PatentUS9516794B2Modular scalable liquid cooled power system

Publication Date: 2016.12.06 TRANSISTOR DEVICES TDI POWER

AI summary

A scalable liquid cooled power system using a number of modularized, hot-plug, hot-swap, and scalable liquid-cooled power conversion modules mounted on mating mounting assemblies. A modularized, scalable liquid coolant manifolds and liquid cooling management system provides coolant circulation through the power conversion modules. The system optionally includes a highly scalable system control and administration system, and optionally provides the facility for on-board liquid-to-air heat exchanger system, or off-board cooling using an external heat exchanger system.