Hybrid Cooling Device for Electronic Modules
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Solution Overview
Problem
Current cooling systems for electronic modules, such as spray and immersion cooling, are complex, heavy, and voluminous, leading to design and production difficulties, increased maintenance needs, and reduced reliability and lifetime due to complex structures and excessive liquid usage.
Innovation Solution
A hybrid cooling device integrating single phase and two phase flow, atomization, and immersion techniques under a single thermal management system, eliminating the need for large structures and reducing mechanical parts, allowing modular cooling based on heat load and using dielectric liquid to prevent electronic module failure from liquid leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If spray cooling or immersion cooling is used for electronic modules, then cooling effectiveness is improved, but system complexity and volume increase
Solution Approach 1:
The patent combines spray cooling and immersion cooling methods into a single hybrid cooling device that can operate in different modes. The device integrates a liquid reservoir, spray nozzles, and immersion capability into one unified system, allowing it to switch between spray and immersion modes based on cooling requirements, thereby reducing overall system complexity while maintaining high cooling effectiveness.
Solution Approach 2:
The hybrid cooling device is designed to perform multiple cooling functions - it can operate as a spray cooling system, an immersion cooling system, or a combination of both. This multi-functionality allows a single device to replace what would otherwise require separate cooling systems, reducing volume and complexity while maintaining effective cooling performance.
2Temperature
If spray cooling with multiple nozzles is used, then cooling coverage is improved, but weight and volume requirements increase
Solution Approach 1:
The patent merges spray cooling and immersion cooling capabilities into a single hybrid system. By combining these methods, the device achieves comprehensive cooling coverage without requiring multiple separate nozzle systems, thereby reducing the overall weight of the cooling apparatus while maintaining effective cooling across all electronic modules.
3Quantity of substance
If liquid distribution manifolds and accumulation manifolds are used, then coolant distribution is improved, but device complexity and maintenance needs increase
Solution Approach 1:
The patent extracts and eliminates the complex manifold system from the cooling device. Instead of using separate liquid distribution manifolds and accumulation manifolds, the hybrid cooling device uses a simplified architecture where the liquid reservoir directly supplies spray nozzles and immersion channels, removing unnecessary components and reducing maintenance requirements while maintaining effective coolant distribution.
4Quantity of substance
If large volume condenser structures and heat exchangers are designed, then vapor condensation is improved, but design and production difficulty increase
Solution Approach 1:
The patent merges the condensation and heat exchange functions into the existing hybrid cooling structure. The liquid reservoir and cooling channels serve dual purposes - both as coolant storage/distribution and as condensation/heat exchange surfaces. This integration eliminates the need for separate large-volume condenser structures and complex heat exchangers, simplifying both design and manufacturing while maintaining effective vapor condensation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid cooling device results in a lighter, smaller, more producible, and cost-effective system with improved durability and reliability, capable of effectively cooling electronic modules in both liquid and dry environments, enhancing performance and longevity, especially in military environments.
Implementation Method 1
the heat released from the modules is transferred to the cold plate via conduction
Implementation Method 2
The liquid flowing through the channels of the cold plate convect the heat dissipated from the modules
Implementation Method 3
electronic cards located in a closed volume are cooled by being wetted in fog generated by a plurality of nozzles
Implementation Method 4
A dielectric heat transfer liquid is stored in this section, and it is sprayed on the electronic cards with a spraying system
Implementation Method 5
a closed cycle condensing system contacts the electronic card, and it is used for condensing the vaporized heat transfer liquid
Data Source
Figure 1~2
Figure 3
AI summary
The present invention relates to a hybrid cooling device (1) which realizes liquid and dry cooling techniques together. The inventive device has dry-spray cooling, dry-immersion cooling, and dry-spray/immersion cooling applications. The said device has an enclosure (2) the inner part of which is divided into two or more sections, a heat discharge section (8) outside the enclosure (2), a heat exchanger (9) outside the heat discharge section (8), fan (10), pump (11), sensor (16), and control unit (18). A spray/immersion section (4) and dry cooling section (5) are provided in the enclosure (2). The inner part of the spray/immersion section (4) is comprised of at least two sections, and in this section there are slots (6) into which the electronic modules will be attached, a reservoir (7) which is placed under the base, a condenser (12) which is placed on the top, spray/immersion channels (14) which are fixed to the walls, nozzle (15) for spray cooling at the end of the spray/immersion channel (14), or an opening for immersion cooling. The slots (6) and the liquid channels (13) are provided in the dry cooling section (5).