Vertical Power Card Switch Alignment for Uniform Cooling

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In semiconductor modules with insulated gate bipolar transistors (IGBTs), temperature differences occur between switches due to varying heat exchange efficiencies, leading to potential performance issues.

Innovation Solution

A power card configuration where switches are aligned vertically, covered with a resin portion, and connected via external terminals, allowing for uniform heat exchange with a refrigerant flowing in a lateral direction, thereby suppressing temperature differences between switches.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If switches are arranged in a conventional semiconductor module configuration, then electrical connection is achieved, but temperature differences occur between switches due to varying heat exchange efficiencies

Engineering Contradiction:
Improvetemperature uniformityVSAvoidperformance consistency
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent changes the spatial arrangement of switches from a planar configuration to a vertical alignment along the height direction. This dimensional change allows all switches to be positioned at substantially the same location relative to the cooling unit, enabling uniform heat exchange with the refrigerant flowing in the lateral direction and eliminating temperature differences between switches.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If switches are aligned vertically to improve heat exchange uniformity, then temperature differences are reduced, but manufacturing complexity increases

Engineering Contradiction:
Improveheat exchange efficiencyVSAvoidalignment precision
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The power card is designed as a universal module with a standardized vertical alignment structure that can be integrated into various cooling units. The switches, resin portion, and external connection terminals form a modular assembly that simplifies manufacturing by providing a repeatable configuration, reducing the impact of alignment precision requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures consistent heat exchange efficiency across switches, reducing temperature differences and enhancing performance by aligning the direction of heat exchange with the flow of refrigerant.

Implementation Method 1

heat exchange with the refrigerant

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20240032265A1Power card
Publication Date: 2024.01.25 DENSO CORP
  • US20240032265A1 patent drawing
  • US20240032265A1 patent drawing
  • US20240032265A1 patent drawing

AI summary

A power card, which is to be aligned in a height direction with a cooling unit in which a refrigerant flows in an inner space extending in a lateral direction, includes a plurality of switches, a resin portion, and a plurality of external connection terminals. The switches are aligned in a vertical direction perpendicular to each of the lateral direction and the height direction. The resin portion covers each of the switches. The external connection terminals are electrically connected to the respective switches and each have a portion exposed from the resin portion.