Porous Metal Heat-Dissipation Layer for OLED Display Thickness
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Solution Overview
Problem
Existing display apparatuses face challenges in improving heat-dissipation efficiency without increasing thickness, which affects rigidity and portability, especially in organic light-emitting display (OLED) devices where heat-dissipation layers are difficult to integrate effectively due to manufacturing processes and design constraints.
Innovation Solution
A display apparatus structure featuring a porous metal heat-dissipation layer with varying thickness and shape, integrated with a rigid metal layer for enhanced heat transfer and rigidity, and extending the heat-dissipation layer to the side surface via laser trimming for improved grounding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat-dissipation layer is added to dissipate heat from the driver integrated circuit, then heat-dissipation efficiency is improved, but the thickness of the display apparatus increases
Solution Approach 1:
The heat-dissipation layer is extended from the rear surface into the side surface of the display apparatus through laser trimming, creating a stepped structure. This dimensional change allows heat dissipation functionality to be achieved without proportionally increasing the overall thickness, as the heat-dissipation layer utilizes the side surface area for heat dissipation.
Solution Approach 2:
The heat-dissipation layer is divided into a first region on the rear surface and a second region extending to the side surface. This segmentation allows different portions of the heat-dissipation layer to serve different functions: the first region provides primary heat dissipation contact with the driver integrated circuit, while the second region extends heat dissipation to the side surface without significantly increasing overall thickness.
2Temperature
If the thickness of the heat-dissipation layer is increased to effectively dissipate heat, then heat-dissipation efficiency is improved, but the overall thickness and bezel area increase
Solution Approach 1:
Instead of increasing heat-dissipation layer thickness uniformly, the layer is extended to the side surface, utilizing the vertical dimension and side surface area for heat dissipation. This approach improves heat dissipation efficiency without increasing the horizontal bezel area.
Solution Approach 2:
The heat-dissipation layer has different thicknesses in different regions: a first thickness in the first region on the rear surface and a second thickness in the second region extending to the side surface. This local quality variation allows effective heat dissipation at the driver integrated circuit location while minimizing overall thickness and bezel area increases.
3Adaptability or versatility
If additional components are disposed in the non-display area to improve functionality, then device functionality is improved, but the width and thickness of the display apparatus increase
Solution Approach 1:
The heat-dissipation layer serves multiple functions: it dissipates heat from the driver integrated circuit, extends to the side surface to provide grounding performance, and is integrated into the existing display panel structure without requiring separate additional components. This multi-functionality improves device performance without increasing thickness.
4Strength
If a rigid structure is added to maintain rigidity after manufacturing, then rigidity is maintained, but the thickness and complexity of the display apparatus increase
Solution Approach 1:
The heat-dissipation layer is merged with the display panel structure through laser trimming, creating an integrated stepped structure. The rigid metal layer and heat-dissipation layer are combined in a single integrated component, maintaining rigidity without adding separate structural elements that would increase complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively enhances heat-dissipation and maintains rigidity without increasing the overall thickness of the display apparatus, improving both heat-dissipation and grounding performance while maintaining design flexibility.
Implementation Method 1
a first heat-dissipation layer disposed at an upper portion of the second member... effectively enhances heat-dissipation
Implementation Method 2
porous metal heat-dissipation layer... improved heat transfer
Implementation Method 3
extending the heat-dissipation layer to the side surface via laser trimming
Data Source
AI summary
A display apparatus includes display panel configured to display an image from one side of the display panel; a first member disposed at another side of the display panel; a first adhesive layer disposed at an upper portion of the first member; a second member disposed at an upper portion of the first adhesive layer; and a first heat-dissipation layer disposed at an upper portion of the second member, wherein the second member includes a first area including a central area of the second member, and a second area including at least three outer edges of the second member, wherein the second member has a vertical dimension or a shape in the first area different from a vertical dimension or a shape of the second member in the second area.