Immersion Cooling Heat Sink With Axial Slot Flow Pathway
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Solution Overview
Problem
Traditional air cooling systems are inadequate for managing thermal challenges in high-performance systems like data centers and edge computing due to increased thermal design power, as they lack the efficiency of liquid cooling in terms of specific heat and latent heat of vaporization.
Innovation Solution
The implementation of immersion cooling systems where electronic components are directly submerged in an electrically insulative liquid coolant, either in single-phase or two-phase configurations, to enhance heat dissipation through direct contact and efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling systems are used, then device complexity is reduced, but heat dissipation efficiency deteriorates due to lower specific heat and latent heat of vaporization compared to liquid
Solution Approach 1:
The patent applies hydraulic cooling by immersing electronic components directly in liquid coolant, utilizing the superior heat capacity and latent heat of vaporization of liquids compared to air. This direct liquid contact enables more efficient heat transfer from hot spots, addressing the heat dissipation efficiency problem while the patent manages the complexity through integrated tank designs and standardized mounting configurations
Solution Approach 2:
The patent utilizes phase transitions of the coolant (evaporation and condensation cycles) to enhance heat dissipation efficiency. The two-phase cooling system leverages the latent heat of vaporization during phase change to absorb large amounts of heat from electronic components, significantly improving thermal management compared to single-phase air cooling systems
2Temperature
If liquid cooling is implemented, then heat absorption capability is improved, but electrical insulation requirements increase due to conductive nature of liquids
Solution Approach 1:
The patent changes the electrical parameter of the coolant by selecting dielectric liquids with appropriate breakdown voltages and insulation properties. This parameter modification allows the liquid to simultaneously provide superior heat absorption capability while maintaining adequate electrical insulation to prevent short circuits in electronic components
Solution Approach 2:
The patent employs composite cooling systems that combine dielectric liquid coolant with hydrophobic coating materials on electronic components. This composite approach enhances both heat transfer efficiency and electrical insulation by creating a protective interface layer that prevents direct conductive contact while maintaining thermal contact
3Temperature
If immersion cooling is used, then heat transfer efficiency is improved, but system maintenance difficulty increases due to liquid handling requirements
Solution Approach 1:
The patent segments the immersion cooling system into modular components including removable tanks, separable cooling loops, and independent coolant circulation systems. This segmentation enables targeted maintenance and repair of specific components without requiring complete system disassembly, reducing maintenance difficulty while preserving the heat transfer efficiency benefits of immersion cooling
Solution Approach 2:
The patent introduces intermediary elements such as removable seals, gaskets, and maintenance ports that facilitate easy access to internal components for cleaning and inspection. These intermediaries simplify liquid handling during maintenance operations while maintaining the sealed immersion environment necessary for optimal heat transfer efficiency
4Temperature
If direct liquid contact cooling is implemented, then thermal management effectiveness is improved, but cost increases due to specialized coolant and system requirements
Solution Approach 1:
The patent modifies the chemical composition parameters of the coolant to use commercially available dielectric fluids with proven thermal properties rather than exotic specialized coolants. This parameter optimization maintains thermal management effectiveness while reducing coolant costs and improving availability for manufacturing and system deployment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively addresses thermal management in high-performance systems by providing superior heat absorption and dissipation capabilities, improving the operational efficiency and reliability of data centers and edge computing environments.
Implementation Method 1
electronic components are directly submerged in an electrically insulative liquid coolant... to enhance heat dissipation through direct contact and efficient heat transfer
Implementation Method 2
efficient heat transfer... providing superior heat absorption and dissipation capabilities
Data Source
AI summary
Methods and apparatus for immersion cooling systems are disclosed herein. An example apparatus includes a base plate, fins extending from the base plate, a tube extending along an axis through the fins, the tube including an inlet, and a slot extending along the axis, the inlet, the slot, and the fins sequentially defining a flow pathway.