Movable Heat Radiating Member With Elastic Thermal Bonding
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Solution Overview
Problem
In electronic apparatuses with movable heat radiating members, securing effective cooling for high-efficiency, high-heat-generating electronic devices is challenging due to the need for small and lightweight heat radiating members, which compromise cooling performance.
Innovation Solution
An electronic apparatus design featuring a heat radiating member with a gap facing a substrate, a fixing assembly, a heat transfer plate, and a thermal bonding material with elasticity, allowing efficient heat transfer and fixation, thereby enhancing cooling capabilities without size or weight restrictions on the heat radiating member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the heat radiating member is made small and light-weight to secure movability, then the movability of the heat radiating member is improved, but the cooling property of the electronic device deteriorates
Solution Approach 1:
The heat dissipation system is divided into two separate components: a movable heat radiating member and a fixed heat transfer plate. The heat transfer plate remains stationary and is fixed to the substrate, while the heat radiating member can move to contact the electronic device. This segmentation allows each component to be optimized independently - the heat radiating member can be lightweight for movability, while the heat transfer plate can be substantial for effective heat transfer.
Solution Approach 2:
The heat transfer plate serves as an intermediary component between the substrate and the heat radiating member. It receives heat from the electronic device through the movable heat radiating member and transfers it to the substrate, acting as a stable thermal conduit that enables effective heat dissipation without requiring the entire heat radiating structure to be heavy and fixed.
2Weight of moving object
If the heat radiating member is made small and light-weight, then the movability is improved, but the heat transfer capability deteriorates
Solution Approach 1:
The system separates the heat collection function (performed by the lightweight, movable heat radiating member) from the heat transfer function (performed by the fixed heat transfer plate). This allows the heat radiating member to be minimal in weight while the heat transfer plate can be designed with sufficient mass and thermal conductivity for effective heat transfer.
Solution Approach 2:
The heat transfer plate acts as an intermediary that bridges the lightweight heat radiating member and the substrate. It receives thermal energy from the heat radiating member and efficiently transfers it to the substrate, compensating for the limited heat transfer capability of the small, lightweight heat radiating member.
3Temperature
If the heat radiating member is made robust for high heat transfer, then the cooling property is improved, but the movability deteriorates
Solution Approach 1:
The heat dissipation function is divided between two components with different design priorities: the heat radiating member is optimized for movability and can be lightweight, while the heat transfer plate is optimized for heat transfer capability and can be robust and substantial in size.
Solution Approach 2:
The heat transfer plate serves as a robust intermediary component that provides stable heat transfer from the electronic device to the substrate. It handles the thermal load and transfer requirements, allowing the heat radiating member to remain lightweight and movable without compromising overall cooling performance.
4Stability of the object's composition
If the heat radiating member is fixed to the substrate, then the stability is improved, but the adaptability to different electronic devices deteriorates
Solution Approach 1:
The system separates the stable, fixed heat transfer plate from the movable, adaptable heat radiating member. The heat radiating member can move to contact different electronic devices with varying positions and thermal characteristics, while the heat transfer plate remains fixed to provide stable heat transfer to the substrate.
Solution Approach 2:
The heat radiating member is designed to be dynamic and movable, allowing it to adapt to different electronic device positions and configurations. This movability provides adaptability to various electronic devices, while the fixed heat transfer plate maintains system stability for heat transfer to the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses thermal resistance and secures efficient heat transfer to the heat radiating member, ensuring effective cooling even for highly efficient and high-heat-generating electronic devices, while allowing for a more robust heat radiating member configuration.
Implementation Method 1
a thermal bonding material which is interposed between the heat radiating member and the heat transfer plate
Implementation Method 2
the heat radiating member is urged toward the substrate by an elastic member
Data Source
AI summary
An electronic apparatus includes a substrate, a heat radiating member which faces the substrate with a gap therebetween, a fixing assembly which fixes the heat radiating member to the substrate, a heat transfer plate disposed on a side of the substrate with respect to the heat radiating member, and a thermal bonding material which is interposed between the heat radiating member and the heat transfer plate, and has elasticity, wherein an electronic device is inserted between the substrate and the heat transfer plate.