Monocrystalline Carbon Substrate Grooving With Laser Deposit Removal

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Solution Overview

Problem

The existing methods for cutting diamond and silicon carbide substrates using laser beams result in the carbonization of diamond, producing graphite products that deposit on the substrate surfaces, potentially causing faults in semiconductor device chips.

Innovation Solution

A method involving two laser beams is employed: a first laser beam with an absorbable wavelength forms processed grooves in the substrate, and a second laser beam with a transmittable wavelength through the substrate but absorbable by the carbon products is used to vaporize and remove the carbonized products by reacting them with oxygen.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a laser beam with wavelength absorbable by the substrate is used to form grooves, then the grooving efficiency is improved, but carbonized products are generated and deposited on the substrate

Engineering Contradiction:

Improvegrooving efficiencyVSAvoidcarbonized product deposition

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The laser processing is divided into two distinct stages: first, a laser beam with wavelength absorbable by the substrate forms grooves efficiently; second, a different laser beam with wavelength absorbable by carbonized products removes the deposits. This segmentation allows each laser beam to be optimized for its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention changes the wavelength parameter of the laser beam between two processing stages. The first laser beam uses a wavelength absorbable by the substrate for efficient grooving, while the second laser beam uses a wavelength absorbable by carbonized products for removal. This parameter change enables both functions to be performed effectively.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If a cutting blade is used to divide high hardness substrates, then the cutting process is simple, but the blade is severely worn and replacement frequency increases

Engineering Contradiction:

Improvecutting process simplicityVSAvoidblade replacement frequency

Core Design Contradiction:

Ease of manufactureVSLoss of time

Solution Approach 1:

The invention replaces the mechanical cutting blade system with a laser-based processing system. The laser beam forms grooves and enables substrate division without physical contact, eliminating blade wear and replacement needs while maintaining process simplicity through automated laser control.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If graphite products are deposited on substrate surfaces, then the substrate can be divided, but electric characteristics of semiconductor devices are varied and faults occur

Engineering Contradiction:

Improvesubstrate division capabilityVSAvoidsemiconductor device yield

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The invention performs preliminary removal of carbonized products using a second laser beam before the substrate is divided into semiconductor devices. This preliminary action prevents graphite deposition from affecting the electric characteristics and reliability of the final semiconductor products.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method improves the yield of semiconductor device chips by effectively removing the carbonized products, thereby preventing faults and enhancing the processing efficiency.

Implementation Method 1

forming a processed groove in the carbon-contained monocrystalline substrate by applying a first laser beam having a wavelength absorbable by the carbon-contained monocrystalline substrate to the carbon-contained monocrystalline substrate

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

applying a second laser beam having a wavelength transmittable through the carbon-contained monocrystalline substrate and absorbable by the products to the carbon-contained monocrystalline substrate along the processed groove

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 3

causing products that contain carbon, that have a structure different from that of a material of the carbon-contained monocrystalline substrate, to react with oxygen to vaporize the products

Methodology Applied

Scientific EffectOxidation: Oxidation

Data Source

PatentUS20250059681A1Method of processing carbon-contained monocrystalline substrate

Publication Date: 2025.02.20 DISCO CORP

AI summary

A method of processing a carbon-contained monocrystalline substrate that contains carbon as a main component of a single crystal includes a processed-groove forming step of forming a processed groove in the substrate by applying a first laser beam having a wavelength absorbable by the substrate to the substrate along a projected dicing line established on one surface of the substrate, and a heating step of causing products that contain carbon, that have a structure different from that of a material of the substrate, that are produced in the processed-groove forming step, and that are positioned at least within the processed groove to react with oxygen to vaporize the products, thereby removing the products, by applying a second laser beam having a wavelength transmittable through the substrate and absorbable by the products to the substrate along the processed groove.